Hakko C1390c HDI PCB Vidhan Sabha Exclude From Bom Solidworks Rogers 4003

Hakko C1390c HDI PCB Vidhan Sabha Exclude From Bom Solidworks Rogers 4003

Welcome to Chengdu Cesgate Technology Co., Ltd

We can provide one-stop service:

PCB circuit boards+Assembly
E-test.
Electronic components purchasing.
PCB assembly: available on SMT, BGA, DIP.
PCBA function test.
Enclosure assembly.

Advantages of HDI PCB

PCB Process - Introduction to HDI
HDI (High Density Interconnect): High-density interconnection technology, mainly using micro-blind / buried vias (blind / buried vias), a technology that makes PCB circuit board circuit distribution density higher. The advantage is that it can greatly increase the usable area of ​​the PCB circuit board, making the product as miniaturized as possible. However, due to the increase in line distribution density, it is impossible to use traditional drilling methods to drill through holes, and some of the via holes must be drilled with laser drilling to form blind holes, or cooperate with inner-layer buried vias to interconnect.

Generally speaking, HDI circuit boards use the build-up method (Build Up), first do or press the inner layers, laser drilling and electroplating on the outer layer are completed, and then the outer layer is covered with an insulating layer (prepreg). ) and copper foil, and then repeat the outer layer circuit making, or continue to laser drill, and stack the layers outward one at a time.

Generally, the diameter of the laser drilling hole is designed to be 3 ~ 4 mil (about 0.076 ~ 0.1 mm), and the insulation thickness between each laser drilling layer is about 3 mil. Due to the use of laser drilling many times, the key to the quality of the HDI circuit board is the hole pattern after laser drilling and whether the hole can be evenly filled after the subsequent electroplating and filling.

Advantages of HDI PCB
1. Can reduce PCB cost. When the PCB density increases beyond eight layers, it is manufactured by HDI and its cost will be lower than the traditional complex pressing process.
2. Increase circuit density, interconnection of traditional circuit boards and parts
3. Promote the use of advanced building techniques
4. Has better electrical performance and signal accuracy
5. Better reliability
6, can improve thermal performance
7. Can improve RFI/EMI/ESD (RFI/EMI/ESD)
8. Improve design efficiency
HDI boards are widely used in mobile phones, digital cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are typically fabricated using a build-up method. The longer the settling time, the higher the technical grade of the board. Regular HDI boards are basically disposable. High-end HDIs use two or more build techniques. At the same time, advanced PCB technologies such as stacked holes, plated hole filling and laser direct drilling are used. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.

PCB Capacities and Technical Specification

Advanced PCB Manufacturing and PCB Assembly Equipment

CESGATE has imported the advanced machinery from US,Japan,German and Israel to improve our production and technical ability.We have set a great example the PCB field of flying probe testing,buried and blind via and special controlled impedance.We have a highly developed R&D division which has helped our factory successfully produce mechanical micro via,high density impedance and HDI.

FAQ