Chemical Gold Aluminum Circuit Board HDI Multilayer PCB 100% E Testing

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL、IATF16949、ISO9001
Model Number: N/A
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Product Name: Circuit Board Resistors Digikey Pcb Assembly HDI PCB Flat Bill Of Materials Feature: Flat Bill Of Materials
Surface Finishing: HASL-LF/OSP/ENIG Etc Solder Mask: Green, White Black Green Blue Red, Green Or Other Color As You Want, Green/blue, Green Black Bule White
Quotation Need: Gerber File Testing Service: 100% Electrical Test, Fly-probe, Function Testing, 100% E-testing, Flying Probe Testing
Shipping: DHL UPS TNT Fedex EMS SMD Speed: CHIP Components SMD Speed 0.3S/pcs, Max Speed 0.16S/pc
High Light:

Chemical Gold aluminum circuit board

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Chemical Gold HDI multilayer PCB

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HDI multilayer PCB 100% E testing

Circuit Board Resistors Digikey Pcb Assembly HDI PCB Flat Bill Of Materials

 

Introduction to our PCBs

PCB Process - Introduction to HDI
HDI (High Density Interconnect): High-density interconnection technology, mainly using micro-blind / buried vias (blind / buried vias), a technology that makes HDI PCB circuit board circuit distribution density higher. The advantage is that it can greatly increase the usable area of ​​the HDI  PCB circuit board, making the product as miniaturized as possible. However, due to the increase in line distribution density, it is impossible to use traditional drilling methods to drill through holes, and some of the via holes must be drilled with laser drilling to form blind holes, or cooperate with inner-layer buried vias to interconnect.

Generally speaking, HDI PCB use the build-up method (Build Up), first do or press the inner layers, laser drilling and electroplating on the outer layer are completed, and then the outer layer is covered with an insulating layer (prepreg). ) and copper foil, and then repeat the outer layer circuit making, or continue to laser drill, and stack the layers outward one at a time.

The following are examples of HDI board types. The pink holes in the picture are blind holes, which are made by laser drilling, and the diameter is usually 3 to 4 mil; the yellow holes are buried holes, which are made by mechanical drilling, and the diameter is at least 6 mil (0.15 mm).

 

Aerospace applications

Like automotive applications, aerospace applications of PCBs require extreme precision and durability. Jets and rockets often experience a lot of turbulence in the atmosphere, which means that ordinary rigid PCBs can be stressed enough to be damaged in the process. To solve this problem, most aerospace manufacturers use flexible PCBs that, in addition to being resistant to vibration damage, are lightweight and small.
In addition to being durable, aerospace PCBs must be very high-functioning and precise, manufactured to the best of their ability to avoid technical issues. Since the electronics used in aerospace technology are critical to the safety of vehicles and their crews, it is critical that they function flawlessly.
Some of the more common aerospace applications for PCBs include:
1. Monitoring equipment: Instrumentation, including accelerometers, pressure sensors, microphones, and torque and force sensors All use PCBs as part of their basic functions. These products are used in the engines and cockpits of aircraft and rockets to monitor vehicle functions and communicate with ground control systems.
2. Test Equipment: In addition to its function as an aircraft, PCBs are involved in the development and testing of aircraft. Test equipment that collects data during structural, vibration, and flight testing uses a PCB as its core. This data can be used to develop more efficient, efficient and safer aircraft.

 

PCB Capacities and Technical Specification

 

NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm

 

 

Company Introduction

Chengdu Cesgate Technology Co., Ltd. is a high-tech company specializing in providing complete electronic solutions for domestic and foreign customers. We specialize in PCB&PCBA processing/ODM/OEM orders. After 12 years of development, we provide a full range of Electronic Manufacturing Services (EMS) for industrial control, automotive industry, medical applications, telecommunications, military and commercial products with rich experience and professional professionalism. Our services include: Printed Circuit Board Design & Layout, PCB Manufacturing, PCB Assembly & Assembly, Test & System Integration.CESGATE is the professional PCB and PCBA Manufacturer, can provide one-stop service from PCB/PCBA Design, PCB/PCBA Clone, PCB manufacturing, Components sourcing, PCB Assembly, and fully product assembly and test. We have got certification of ISO 9001, ISO 13485 and UL. Our capacity including: 1-32 layers FR4 PCB board manufacturing, 1-12 layers Flexible PCB manufacturing, Aluminum PCB and Ceramic PCB manufacturing, can finish about 324000pcs PCBA per months.

 

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FAQ

 

Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”~5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”.
Q: What does CESGATE need for a customized PCB order?
CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products.
Q: How can we ensure our information should not let third party to see our design?
CESGATE: We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level.
Q: Which express companies do you cooperate with?
CESGATE: We cooperate with express companies, including DHL, FedEX, UPS, TNT and EMS. And we also have our own freight forwarders, with lower shipping fees.

Q: What are the common substrates of CESGATE?
A:Tg-140: ISOLA FR402 / NAN-YA NP-140
Tg-150: ISOLA IS400 / NAN-YA NP-155
Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F

 

 

 

 

Contact Details
Kevin

WhatsApp : +8618349393344