Place of Origin: | China |
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Brand Name: | CESGATE |
Certification: | UL、IATF16949、ISO9001 |
Model Number: | N/A |
Minimum Order Quantity: | 1PCS( NO MOQ) |
Price: | Negotiable (Depends on your GERBER and BOM) |
Packaging Details: | PCB: Vacuum Packing / PCBA: ESD Packing |
Delivery Time: | 1-30 working days |
Payment Terms: | T/T, L/C |
Supply Ability: | 30,000pcs/month |
Product Name: | Blue Circuit Board Electronic Circuit Assembly HDI PCB Sap Bom Transaction | Feature: | Blue Circuit Board |
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Base Material: | FR-4, TACONIC, Aluminum, CEM-3, Metal/ceramic/aluminum Base | Surface Finishing: | HASL, Chemical Tin, Chemical Gold, Immersion Gold, HASL |
Solder Mask: | Green, White Black Green Blue Red, Green Or Other Color As You Want, Green/blue, Green Black Bule White | Application: | Electronics Device, Consumer Electronics, Communications, And So On, Universal |
Certificate: | IATF16949/ISO13485/ISO9001/ISO14001 | Testing Service: | 100% Electrical Test, Fly-probe, Function Testing, 100% E-testing, Flying Probe Testing |
High Light: | electronic circuit board 600mm*1200mm,Aluminum TP series electronic circuit board,Aluminum TP series HDI PCB |
Blue Circuit Board Electronic Circuit Assembly HDI PCB Sap Bom Transaction
Introduction to PCBs
PCB characteristics: 1. High wiring density, small size and light weight, which is conducive to the miniaturization of electronic equipment. 2. Due to the repeatability and consistency of the graphics, errors in wiring and assembly are reduced, and equipment maintenance, debugging and inspection time are saved. 3. It is conducive to mechanized and automated production, improving labor productivity and reducing the cost of electronic equipment. 4. The design can be standardized and easy to exchange. HDI PCB is the abbreviation of Printed Circuit Board, translated into Chinese called printed circuit board, because it is made by electronic printing, so it is called "printed" circuit board. HDI PCB is an important electronic component in the electronics industry, a support for electronic components, and a carrier for electrical connection of electronic components. PCB has been widely used in the manufacture of electronic products. why it is widely used.
Consumer Electronics Industry
Printed circuit boards are bridges that carry electronic components and connect circuits. They are widely used in communication electronics, consumer electronics, computers, automotive electronics, industrial control, medical equipment, national defense and aerospace. missing electronic components.In the current environment of accelerated evolution of cloud technology, 5G network construction, big data, artificial intelligence, sharing economy, Industry 4.0, and the Internet of Things, the PCB industry, as the "mother of electronic products", will become the link in the entire electronics industry chain. base strength.In recent decades, AR, VR, tablet computers, and wearable devices have frequently become hot spots in the consumer electronics industry, making HDI PCB applications widely distributed in the consumer electronics industry, with the characteristics of large demand, large number of orders, and rapid replacement.
PCB Capacities and Technical Specification
NO. | Items | Capabilities |
1 | Layers | 2-68L |
2 | Maximum machining size | 600mm*1200mm |
3 | Board thickness | 0.2mm-6.5mm |
4 | Copper thickness | 0.5oz-28oz |
5 | Min trace/space | 2.0mil/2.0mil |
6 | Minimum finished aperture | 0. 10mm |
7 | Maximum thickness to diameter ratio | 15:1 |
8 | Via treatment | Via, blind&buried via, via in pad, Copper in via … |
9 | Surface finish/treatment | HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating |
10 | Base Material | FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350, Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) |
11 | Solder mask color | Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black |
12 | Testing Service | AOI, X-Ray, Flying-Probe, Function Test, First Article Tester |
13 | Profiling Punching | Routing,V-CUT,Beveling |
14 | Bow&twist | ≤0.5% |
15 | HDI type | 1+n+1,2+n+2,3+n+3 |
16 | Min mechanical aperture | 0.1mm |
17 | Min laser aperture | 0.075mm |
Who are we?
Small to medium volume PCB manufacturer
Multi PCB types manufacturer
EMS/PCBA/OEM customers reliable PCB partner
Trustworthy supplier for PCB trading companies
Powerful Factory, Quality First .
10 years PCB Manufacturer Experience .
Advanced Automation Production Facilities.
ISO9001, ISO14001 And UL Certified.
FAQ
Q: What is needed for PCB & PCBA quotation? CESGATE: For PCB: Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness) and quantity you need. For PCBA: Files mentioned above, BOM, pick and place file. |
Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board? CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”~5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”. |
Q: What are the main products of your PCB/PCBA services? CESGATE: Automotive, Military, Aerospace, Industry Control, Medical care, IOT, Smart Home, Robot, Auto parts, Camera, UAV. |
Q: What are the types of solder mask? CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type. |
Q: How long is the shelf life of the PCB board and how should it be stored? CESGATE: 25℃ / 60%RH is recommended when the PCB is stored. The plate itself has no shelf life, but if it exceeds three months, it needs to be baked to remove moisture and stress, and it should be used immediately after baking. It is recommended that the pieces should be loaded within 6 months of storage to reduce the phenomenon of rejection and explosion. |