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High Density Interconnect PCB HDI PCB Circuit Boards 0.5oz To 28oz

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL、IATF16949、ISO9001
Model Number: N/A
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Product Name: Differential Pair Altium Circuit Card Assy HDI PCB Solidworks Bom Template Feature: Differential Pair Altium Circuit
Base Material: FR-4, TACONIC, Aluminum, CEM-3, Metal/ceramic/aluminum Base Surface Finishing: HASL, Chemical Tin, Chemical Gold, Immersion Gold, HASL
Solder Mask: Green, White Black Green Blue Red, Green Or Other Color As You Want, Green/blue, Green Black Bule White Application: Electronics Device, Consumer Electronics, Communications, And So On, Universal
Copper Thickness Color: 1/2 Oz Min; 12 Oz Max Testing Service: 100% Electrical Test, Fly-probe, Function Testing, 100% E-testing, Flying Probe Testing
High Light:

high density interconnect PCB


HDI PCB 28oz


0.5oz HDI Circuit Boards

0.5oz-28oz Copper Altium HDI Circuit Boards Matte Green Matte Black

Introduction to HDI


HDI (High Density Interconnection): High-density interconnection technology, mainly using micro-blind vias/buried vias (blind vias/buried vias), which is a technology that makes HDI PCB circuit boards more densely distributed. Its advantage is that the PCB circuit board can be greatly increased and the product can be miniaturized as much as possible. However, due to the increase in line distribution density, it is impossible to use traditional drilling methods to drill holes. Some vias must be drilled with lasers to form blind holes, or interconnected with embedded via holes in the inner layer to complete the external layer. Laser drilling and plating, then covering the outer layer with an insulating layer (prepreg). ) and repeat the outer layer circuit fabrication, or continue laser drilling, stacking outward one layer at a time.

Usually, the diameter of the laser drilled holes is designed to be 3~4 mils (about 0.076~0.1mm), and the insulation thickness between each laser drilled layer is about 3 mils. Since laser drilling is used many times, the key to the quality of HDI circuit boards is the hole pattern after laser drilling, and whether the holes can be uniformly filled after subsequent plating and filling.

Below are examples of HDI PCB board types. The pink holes in the picture are blind holes, laser drilled and typically 3 to 4 mils in diameter; the yellow holes are buried holes formed by mechanical drilling and are at least 6 mils (0.15mm) in diameter.



Medical equipment


Electronics make a major contribution to health - the nursing industry, as diagnostic, monitoring and therapeutic equipment. As the development of electronics becomes more efficient and dense, the medical applications of these electronic devices continue to grow, leading to endless new possibilities.At the heart of these medical devices is the HDI PCB. PCBs in the medical industry are highly specialized to accommodate the unique constraints of medical devices. In many medical applications, small packages are required to meet the size requirements for implants or emergency room monitors. Therefore, medical PCBs tend to be specialty high-density interconnect PCBs, also known as HDI PCBs. Medical PCBs can also be made with flexible substrates that allow the HDI PCB to bend during use, which is essential for both internal and external medical devices.

1. Monitors: Personal and healthcare monitors, including blood glucose monitors, heart rate and blood pressure monitors, and more.
2. Scanning Technology: CT scanners and ultrasound technology typically use PCB-based electronics.
3. Control System: The device controls the infusion, flow rate and distribution are electronically controlled.
4. Internal Devices: Pacemakers and similar internal medical devices keep patients healthy and are operated by a central micro-PCB.




PCB Capacities and Technical Specification


NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm



Company introduction


CESGATE is a company with a senior team. 80% of the senior management have a master's degree or above, and 100% of the sales team have a bachelor's degree or above. We operate 24 hours a day, 7 days a day, to provide customers with the best services and solutions. Our factory is located in Building 6, Fuyuan industrial park, Qiaotang road, Fuyong street , Shenzhen city, China , with a central warehouse of 1600 square meters, which can meet your production needs. With its own strength and professional ability, our group is your preferred electronic component distributor service.

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Q: What is needed for PCB & PCBA quotation?
CESGATE: For PCB: Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness) and quantity you need.
For PCBA: Files mentioned above, BOM, pick and place file.
Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
Q: What are the main products of your PCB/PCBA services?
CESGATE: Automotive, Military, Aerospace, Industry Control, Medical care, IOT, Smart Home, Robot, Auto parts, Camera, UAV.
Q: What is your minimum order quantity (MOQ)?
CESGATE: Our MOQ is 1 PCS, we are able to handle Small as well as large volume production with flexibility.
Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”~5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”.





Contact Details

Phone Number : +8613924238867

WhatsApp : +8618349393344