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Pin Header Female Semiconductor PCB Custom PCB Assembly Boards

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL、IATF16949、ISO9001
Model Number: N/A
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Product Name: Pin Header Female Custom Circuit Board Assembly Semiconductor PCB Through Hole Feature: Pin Header Female
Base Material: FR-4, TACONIC, Aluminum, CEM-3, Metal/ceramic/aluminum Base Service: One-stop Pcb Assembly
Solder Mask: Green, White Black Green Blue Red, Green Or Other Color As You Want, Green/blue, Green Black Bule White Application: Electronics Device, Consumer Electronics, Communications, And So On, Universal
Solder Mask Color: Green, Blue, White And Red, White Black Yellow Green Red, Purple MOQ: No MOQ
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custom PCB assembly ISO9001


Pin Header Female Semiconductor PCB


custom pcb boards ISO9001

Pin Header Female Custom Circuit Board Assembly Semiconductor PCB Through Hole


Semiconductor PCBA Manufacturing Service Requirements


Build Flexibility

Semiconductor boards must often transmit, receive, and process various signal types, interconnect using different types of connectors, and perform in unique environments. Therefore, your CM must excel in all types of board building, and they must meet IPC Class 1, 2, and 3 performance level standards. Additionally, they should be able to manufacture non-standard form factors.

Secure Component Procurement

For turnkey, your CM is responsible for procuring components (with the possible exception of exotic components) from a secure supply chain that is free of counterfeits and obsolete components.
Quality Assembly

Semiconductor PCBA reliability is only attainable with quality assembly. Your board’s ability to last throughout its intended lifecycle depends on high-quality solder connections for both SMDs and through-hole components.
Process Agility

Design changes may be required to add or improve functionality or meet customer demands. Time may be of the essence here, and your CM needs an agile manufacturing process that can incorporate changes quickly with minimal process adjustments or the need for additional equipment.

Accurate and Accessible Documentation

As semiconductor PCBAs may experience multiple revisions or integration into other design projects, accurate and thorough documentation is mandatory.


While other considerations may arise when assessing a CM’s ability to meet your turnkey semiconductor service needs, ensuring it can satisfy the requirements listed above is essential.



Having the essentials is a good start; however, competition to introduce new semiconductor boards means our turnkey semiconductor PCB services must also attract new customers. To do this, we need to have a strong supply chain that can overcome the devastating effects of insufficient semiconductor procurement, especially in the current global shortage of electronic components. We also need to deliver superior performance and the ability to deliver boards on time and as needed. In order to meet these demands, we need a CM that provides optimized semiconductor PCB services with the following key attributes.




Application advantages of multilayer circuit boards:


1. High assembly density, small size, and light weight, meeting the needs of lightweight and miniaturized electronic equipment;
2. Due to the high assembly density, the wiring between components (including components) is reduced, the installation is simple, and the reliability is high;
3. Due to the repeatability and consistency of the graphics, the wiring and assembly errors are reduced, and the time for equipment maintenance, debugging and inspection is saved;
4. The number of wiring layers can be increased, thereby increasing design flexibility;
5. Can form a circuit with a certain impedance, can form a high-speed transmission circuit;
6. Circuit and magnetic circuit shielding layers can be set up, and metal core heat dissipation layers can also be set up to meet the needs of special functions such as shielding and heat dissipation.

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Q: What is your delivery date?
CESGATE: The general sample delivery time is 6 working days for single and double-sided boards, 7 working days for 4-layer boards, and an additional working day for every 2 layers. However, if there are special processes, additional working days will be added according to the situation.
Generally, the delivery time for mass production is 10 working days for single and double-sided panels, and 15 working days for multi-layer panels. However, if there is a special process or more than a certain number of working days, the working days will be additionally increased according to the situation; you can also pay the urgent fee to shorten the number of days, please contact Contact the business specially proposed, depending on the individual situation to provide expedited days.
Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
Q: What are the types of solder mask?
CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type.
Q: What are the common substrates of CESGATE?
A:Tg-140: ISOLA FR402 / NAN-YA NP-140
Tg-150: ISOLA IS400 / NAN-YA NP-155
Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F

Contact Details

Phone Number : +8613924238867

WhatsApp : +8618349393344