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AOI Test OEM PCBA Semiconductor PCB One Stop Fabrication

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL、IATF16949、ISO9001
Model Number: N/A
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Product Name: AOI Test OEM PCBA Manufacturering Semiconductor PCB One Stop Fabrication Feature: AOI Test
Base Material: FR-4, TACONIC, Aluminum, CEM-3, Metal/ceramic/aluminum Base Type: Semiconductor Tools Systems And Components, Equipment Comp
Solder Mask: Green, White Black Green Blue Red, Green Or Other Color As You Want, Green/blue, Green Black Bule White Application: Electronics Device, Consumer Electronics, Communications, And So On, Universal
Solder Mask Color: Green, Blue, White And Red, White Black Yellow Green Red, Purple Minimum Order Quantity: 1PCS
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AOI Test Semiconductor PCB




Semiconductor PCB One Stop Fabrication

AOI Test OEM PCBA Manufacturering Semiconductor PCB One Stop Fabrication



Semiconductor boards differ from most other custom PCBAs because they are not intended for a single application. Instead, these boards are meant to be applied widely and across many different industries. The boards may be used as samples to display capabilities, or they may be installed into a larger system for faster bringup. When designing and building semiconductor boards, reliability is the key attribute, regardless of how the board is utilized.



Semiconductor PCBA Manufacturing Service Requirements


Build Flexibility

Semiconductor PCB must often transmit, receive, and process various signal types, interconnect using different types of connectors, and perform in unique environments. Therefore, your CM must excel in all types of board building, and they must meet IPC Class 1, 2, and 3 performance level standards. Additionally, they should be able to manufacture non-standard form factors.

Secure Component Procurement

For turnkey, your CM is responsible for procuring components (with the possible exception of exotic components) from a secure supply chain that is free of counterfeits and obsolete components.
Quality Assembly

Semiconductor PCB reliability is only attainable with quality assembly. Your board’s ability to last throughout its intended lifecycle depends on high-quality solder connections for both SMDs and through-hole components.

Process Agility

Design changes may be required to add or improve functionality or meet customer demands. Time may be of the essence here, and your CM needs an agile manufacturing process that can incorporate changes quickly with minimal process adjustments or the need for additional equipment.

Accurate and Accessible Documentation

As semiconductor PCB may experience multiple revisions or integration into other design projects, accurate and thorough documentation is mandatory.


While other considerations may arise when assessing a CM’s ability to meet your turnkey semiconductor service needs, ensuring it can satisfy the requirements listed above is essential.



PCB Capacities and Technical Specification


NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm



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Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
Q: What are the types of solder mask?
CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type.
Q: What are the common substrates of CESGATE?
A:Tg-140: ISOLA FR402 / NAN-YA NP-140
Tg-150: ISOLA IS400 / NAN-YA NP-155
Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F

Contact Details

Phone Number : +8613924238867

WhatsApp : +8618349393344