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Quick Turn Printed Multilayer PCB Circuit Board PCB Design 1.6mm Thick

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: ISO9001/ ISO14001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Product Name: Quick Turn Pcb Prototypes Multilayer PCB Circuit Board Soldering Pads Through Hole Feature: Soldering Through Hole
Supply Ability: 1000 Unit/Units Per Week Testing Service: AOI X-Ray Function Test
Service: Full Turnkey Service PCB+Components+Assembly Function: PCBA Board Service Prototype PCB Assembly
Board Thickness: 1.6mm Min Components Size: 0201-54 Sq.mm (0.084 Sq.inch),Long Connector,CSP,BGA,QFP
High Light:

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Quick Turn Pcb Prototypes Multilayer PCB Circuit Board Soldering Pads Through Hole

 

 

Lead-time for multilayer PCB Components Sourcing

 

This is the duration required to manufacture the component. It includes order preparation, queuing, setup, run, inspection and storage times.
For build-to-order products, it is the time it takes from order release to production and shipment.
Improving lead times is a new trend in electronic component procurement. This poses a huge challenge for the procurement community.
There is often no stability in terms of lead times.
The increase in lead time is a complex situation due to market demand, investment constraints and capacity allocation in some regions.
Lead time is usually 5-8 working days from the first day of the order. For mass production, the lead time will take up to 2 weeks.
However, this may vary by region. For example, lead times for resistors in North America increased from 12 to 16 weeks by early 2017.

 

 

PCB Capabilities

NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm

 

Who are we?

In business since 2010, CESGATE mainly provides pcb fabrication and design service for customers from all over the world. We have ISO and UL certificate,and honored as HI-TECH enterprise by Chengdu goverment.
As a professional multilayer PCB factory , we can provide prototype and low-to-mid volume multilayer PCB fabrication and design services for our customers. We are in Chengdu, China, which is the largest center of technology and electronics manufacturing in the world. Cooperating with our engineering team, quality team, these allow us to offer our customers low-cost, One-stop PCB Services.

 

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FAQ

 

 

Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
Q: What does CESGATE need for a customized PCB order?
CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products.
Q: Do you have any other services?
CESGATE: We mainly focus on the procurement services of PCB + assembly + components. In addition, we can also provide programming, testing, cable, housing assembly services.
Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”~5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”.

 

 

 

 

 

Contact Details
Kevin

Phone Number : +8613924238867

WhatsApp : +8618349393344