Thickness 1.6MM Multilayer PCB Audio PCB Board FR408 FR408HR

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Brief Introduction to our PCBs

PCB Process - Introduction to HDI
HDI (High Density Interconnect): High-density interconnection technology, mainly using micro-blind / buried vias (blind / buried vias), a technology that makes multilayer PCB circuit board circuit distribution density higher. The advantage is that it can greatly increase the usable area of ​​the multilayer PCB circuit board, making the product as miniaturized as possible. However, due to the increase in line distribution density, it is impossible to use traditional drilling methods to drill through holes, and some of the via holes must be drilled with laser drilling to form blind holes, or cooperate with inner-layer buried vias to interconnect.Generally speaking, HDI circuit boards use the build-up method (Build Up), first do or press the inner layers, laser drilling and electroplating on the outer layer are completed, and then the outer layer is covered with an insulating layer (prepreg). ) and copper foil, and then repeat the outer layer circuit making, or continue to laser drill, and stack the layers outward one at a time.

Generally, the diameter of the laser drilling hole is designed to be 3 ~ 4 mil (about 0.076 ~ 0.1 mm), and the insulation thickness between each laser drilling layer is about 3 mil. Due to the use of laser drilling many times, the key to the quality of the HDI circuit board is the hole pattern after laser drilling and whether the hole can be evenly filled after the subsequent electroplating and filling.

The following are examples of HDI board types. The pink holes in the picture are blind holes, which are made by laser drilling, and the diameter is usually 3 to 4 mil; the yellow holes are buried holes, which are made by mechanical drilling, and the diameter is at least 6 mil (0.15 mm).

Company Introduction

CESGATE is located in Chengdu High-tech Industrial Park, focusing on the development of the electronics industry, with the corporate mission of "making electronic manufacturing more efficient", and is committed to becoming an international leading electronic manufacturing platform. The business covers multilayer PCB, PCBA, component BOM, wiring harness customization, connector solutions and other fields.CESGATE with customers to provide them with the highest-quality PCB and PCBA electronic manufacturing services to achieve their goals. Our flexibility is in meeting customer requirements and our superior customer service. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly.We provide one-stop electronic manufacturing service to help you qualify your designs and provide quality samples to your customers.

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