Fr4 Circuit Board Multilayer PCB Iso9001 Smd Ics Quick Turn Prototype ISO16949

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: ISO9001/ ISO14001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Product Name: Fr4 Circuit Board Multilayer PCB Iso9001 Smd Ics Quick Turn Prototype ISO16949 Feature: Fr4 Circuit Board
Supply Ability: 1000 Unit/Units Per Week Testing Service: 100% AOI Testing/ICT/FCT Test
Service: Full Turnkey Service PCB+Components+Assembly Application: Electronics Device/Home Appliances
Certificate Standard: IPC-A-600H Class 2, Class 3, TS16949,ROHS Sweat-Solder: Metal Material:Copper,Aluminum
High Light:

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Fr4 Circuit Board Multilayer PCB Iso9001 Smd Ics Quick Turn Prototype ISO16949

 

Technical Requirement for pcb assembly:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206, 0805, 0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) multilayer PCB Assembly With CE, FCC, Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

 

 

PCB Capabilities

NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm

 

Who are we?

CESGATE is a team with more than 10 years experience in the field. We owns abundant experiences for serving overseas customers from industrial automatic control, communication, medical, Auto and consumer electronics,etc. We test our product strictly to guarantee the quality to our customers. We accumulate high reputation during our cooperation.You will achieve following value-added services when you cooperate with us:

One-stop multilayer PCB/PCBA Service
Optimizing your multilayer PCB design during production
Satisfied quality with competitive prices
Instant response in both quotation and delivery
Increase your business with our powerful support

 

 

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FAQ

 

 

Q: DO YOU TEST ALL YOUR GOODS BEFORE DELIVERY?
CESGATE: 1. Our products are all original, and we will test the goods before shipment by professional machines like KEYSIGHT E4991A and KEYSIGHT E4980.
2. If The buyer need Test Report, we can send the product to anthoritative institution such as White horse Laboratories(SZ) Limited,Global Electronics Testing,etc.
Q: What does CESGATE need for a customized PCB order?
CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products.
Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”~5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”.
Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.

 

 

 

 

 

Contact Details
Maggie

Phone Number : +8613679040050

WhatsApp : +8618349393344