| Place of Origin: | China |
|---|---|
| Brand Name: | CESGATE |
| Certification: | ISO9001/ ISO14001 |
| Model Number: | NA |
| Minimum Order Quantity: | 1PCS( NO MOQ) |
| Price: | Negotiable (Depends on your GERBER and BOM) |
| Packaging Details: | PCB: Vacuum Packing / PCBA: ESD Packing |
| Delivery Time: | 1-30 working days |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 30,000pcs/month |
| Product Name: | Fr4 Circuit Board Multilayer PCB Iso9001 Smd Ics Quick Turn Prototype ISO16949 | Feature: | Fr4 Circuit Board |
|---|---|---|---|
| Supply Ability: | 1000 Unit/Units Per Week | Testing Service: | 100% AOI Testing/ICT/FCT Test |
| Service: | Full Turnkey Service PCB+Components+Assembly | Application: | Electronics Device/Home Appliances |
| Certificate Standard: | IPC-A-600H Class 2, Class 3, TS16949,ROHS | Sweat-Solder: | Metal Material:Copper,Aluminum |
| High Light: | Multilayer PCB Uyue 946c,Multilayer PCB Altair Pollex |
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Fr4 Circuit Board Multilayer PCB Iso9001 Smd Ics Quick Turn Prototype ISO16949
Technical Requirement for pcb assembly:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206, 0805, 0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) multilayer PCB Assembly With CE, FCC, Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
PCB Capabilities
| NO. | Items | Capabilities |
| 1 | Layers | 2-68L |
| 2 | Maximum machining size | 600mm*1200mm |
| 3 | Board thickness | 0.2mm-6.5mm |
| 4 | Copper thickness | 0.5oz-28oz |
| 5 | Min trace/space | 2.0mil/2.0mil |
| 6 | Minimum finished aperture | 0. 10mm |
| 7 | Maximum thickness to diameter ratio | 15:1 |
| 8 | Via treatment | Via, blind&buried via, via in pad, Copper in via … |
| 9 | Surface finish/treatment | HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating |
| 10 | Base Material | FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350, Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) |
| 11 | Solder mask color | Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black |
| 12 | Testing Service | AOI, X-Ray, Flying-Probe, Function Test, First Article Tester |
| 13 | Profiling Punching | Routing,V-CUT,Beveling |
| 14 | Bow&twist | ≤0.5% |
| 15 | HDI type | 1+n+1,2+n+2,3+n+3 |
| 16 | Min mechanical aperture | 0.1mm |
| 17 | Min laser aperture | 0.075mm |
Who are we?
CESGATE is a team with more than 10 years experience in the field. We owns abundant experiences for serving overseas customers from industrial automatic control, communication, medical, Auto and consumer electronics,etc. We test our product strictly to guarantee the quality to our customers. We accumulate high reputation during our cooperation.You will achieve following value-added services when you cooperate with us:
One-stop multilayer PCB/PCBA Service
Optimizing your multilayer PCB design during production
Satisfied quality with competitive prices
Instant response in both quotation and delivery
Increase your business with our powerful support
FAQ
| Q: DO YOU TEST ALL YOUR GOODS BEFORE DELIVERY? CESGATE: 1. Our products are all original, and we will test the goods before shipment by professional machines like KEYSIGHT E4991A and KEYSIGHT E4980. 2. If The buyer need Test Report, we can send the product to anthoritative institution such as White horse Laboratories(SZ) Limited,Global Electronics Testing,etc. |
| Q: What does CESGATE need for a customized PCB order? CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products. |
| Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board? CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”～5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”. |
| Q: What is the difference between the HDI board and the general circuit board? CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once. |
