| Place of Origin: | China |
|---|---|
| Brand Name: | CESGATE |
| Certification: | UL、IATF16949、ISO9001 |
| Model Number: | N/A |
| Minimum Order Quantity: | 1PCS( NO MOQ) |
| Price: | Negotiable (Depends on your GERBER and BOM) |
| Packaging Details: | PCB: Vacuum Packing / PCBA: ESD Packing |
| Delivery Time: | 1-30 working days |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 30,000pcs/month |
| Product Name: | Rohs Compliant Pcb Assembly Semiconductor PCB Bom Sheet Format Cs03 In Sap | Feature: | Rogers 4003c |
|---|---|---|---|
| Base Material: | FR-4, TACONIC, Aluminum, CEM-3, Metal/ceramic/aluminum Base | Min. Line Spacing: | 1.6mm, 0.2-6.0mm, 0.2mm-6.00 Mm(8mil-126mil), 0.5~3.2mm, 1.6 Mm |
| Solder Mask: | Green, White Black Green Blue Red, Green Or Other Color As You Want, Green/blue, Green Black Bule White | OEM/ODM: | T-SOAR One-stop Service |
| Solder Mask Color: | Green, Blue, White And Red, White Black Yellow Green Red, Purple | Testing Service: | 100% Electrical Test, Fly-probe, Function Testing, 100% E-testing, Flying Probe Testing |
| High Light: | Rogers 4003c Semiconductor PCB,Cs01 Semiconductor PCB |
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Rogers 4003c Semiconductor PCB Best Bom Software Cs01 In Sap Easyeda Designer
Who are we?
PCB manufacturer located in Chengdu.
Over 300 total staff
25,000sqm production capacity
Advanced automatic production equipments
Offers various kinds PCBs, small to medium to mass quantity orders
Major markets include domestic China, Asia, Europe and North America
Customers include OEM/ODM factories, PCBA factories, EMS, trading companies
CESGATE's advantages
1. 1600 square meters central warehouse
2. Full range of Yageo, Murata, Avx, Kemet RC
3. Temperature and humidity control, first in first out mechanism
4. PCB Assembly With CE, FCC, Rohs Approval
5. Nitrogen gas reflow soldering technology for SMT.
6. High Standard SMT&Solder Assembly Line
How to Design for Reliability When Building Semiconductor PCBAs
For electronic systems users, the two most important factors are performance and reliability. Performance simply means that the device or product meets its functionality requirements. Reliability, on the other hand, denotes the device’s ability to not only perform but to do so consistently over its expected operational lifetime. Since semiconductor repair is often impossible, meeting this requirement is critical.
Semiconductor reliability begins with a manufacturing process that stresses QC. However, ensuring reliability does not end with manufacturing. To ensure that your PCBAs that contain semiconductors achieve expectations, there are design for reliability considerations that must be understood and applied during development.
PCB Capacities and Technical Specification
| NO. | Items | Capabilities |
| 1 | Layers | 2-68L |
| 2 | Maximum machining size | 600mm*1200mm |
| 3 | Board thickness | 0.2mm-6.5mm |
| 4 | Copper thickness | 0.5oz-28oz |
| 5 | Min trace/space | 2.0mil/2.0mil |
| 6 | Minimum finished aperture | 0. 10mm |
| 7 | Maximum thickness to diameter ratio | 15:1 |
| 8 | Via treatment | Via, blind&buried via, via in pad, Copper in via … |
| 9 | Surface finish/treatment | HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating |
| 10 | Base Material | FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350, Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) |
| 11 | Solder mask color | Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black |
| 12 | Testing Service | AOI, X-Ray, Flying-Probe, Function Test, First Article Tester |
| 13 | Profiling Punching | Routing,V-CUT,Beveling |
| 14 | Bow&twist | ≤0.5% |
| 15 | HDI type | 1+n+1,2+n+2,3+n+3 |
| 16 | Min mechanical aperture | 0.1mm |
| 17 | Min laser aperture | 0.075mm |
FAD
| Q: How can we ensure our information should not let third party to see our design? CESGATE: We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level. |
| Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board? CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material. |
| Q: Do you have any other services? CESGATE: We mainly focus on the procurement services of PCB + assembly + components. In addition, we can also provide programming, testing, cable, housing assembly services. |
| Q: Why choose us? CESGATE: Professional and experienced R&D team. Advanced production equipment, scientific and reasonable process flow. Reliable and strict quality control system. We test all our products before shipment to make sure everything is in perfect condition. |
