PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: ISO9001/ ISO14001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Product Name: OEM Electronic Prototype HDI Aluminum FR4 High Frequency PCB Soldering Machine Feature: HDI Aluminum
Min. Line Width: 0.2mm, 3mi, 0.075mm, 0.075mm/0.075mm(3mil/3mil), 0.1 0mm Min. Hole Size: 0.20mm, 0.1mm, 8 Mil, 0.254-0.40mm, 0.1mm-1mm
Surface Finishing: HASL, OSP, ENIG, Immersion Gold, HASL Lead Free/OSP/Soft Gold/Hard Gold Solder Mask: White, Blue, Green. Red. Blue. White. Black.Yellow, Green, Black
Copper Thickness: 1oz, 1/2OZ 1OZ 2OZ 3OZ, As Your Request, 0.5-3.0 Oz, 1 Oz Base Material: RO3003, RO4350, PTFE, TU872, M4, M6
High Light:

PTFE TU872 High Frequency PCB

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PTFE TU872 HDI circuit boards

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fr4 printed circuit board Matte Green

OEM Electronic Prototype HDI Aluminum FR4 High Frequency PCB Soldering Machine

 

 

High Frequency PCB Fabrication Process


Copper printing for the inner layers


The actual manufacturing of the PCB by your manufacturer takes place at this stage.

Once you have printed the PCB onto the laminate, you will pre-bond the copper on the same laminate that acts as the structure of your PCB.

After that, you engrave the copper to reveal the earlier blueprint of your PCB. You then cover your laminate panel using a photosensitive film known as a resist.

The composition of this resist is a photoreactive chemical layer which hardens when you expose it to ultraviolet light.

Resist allows your manufacturer to obtain the best match between the printed results on the photoresist and the blueprint photos.

After lining up of your laminate and the resist using the hole, you will expose them to ultraviolet light.

Here, the light will travel through the translucent areas of the film which hardens the photoresist.

By hardening, you can see the copper areas which you have to use as pathways.

On the other hand, the black ink will intercept any light that tries to reach the areas which are not to be hardened which you can remove later.

After preparing the PCB, you will have to wash it using an alkaline solution which removes remnants of the resist.

Next, you have to pressure wash your PCB to detach anything that remains on the surface.

The next step is to allow your PCB to dry. After that, remove the resist from the PCB apart from the ones on the top of the copper. Be careful to avoid any errors at this stage.

 

High Frequency PCB Fabrication Process


PCB Plating


After drilling, you can now go ahead and plate your PCB. In this process, you will use chemicals to join the different layers together.

You will have to clean the PCB thoroughly before you bath it in various chemicals.

Coating of the panel in a micro – copper layer takes place during the bathing process. Bathing also helps in covering the walls of the drilled copper walls.

 

 

What is the difference between high speed PCB and high frequency PCB?

 

High speed and high frequency pcb is different. High-speed circuit refers to that the voltage rises or falls in a short period of time, and High Frequency circuit refers to that the circuit has a short period. But there is no exact difference between a high-speed PCB and a High Frequency PCB. Even the basic materials are the same. So if you ask the difference between high-speed PCB and High Frequency PCB, ignore the name of the circuit board, and focus on how to maintain the signal integrity of the circuit.

 

PCB Capacities and Technical Specification

 

NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm

 

 

Company introduction

 

CESGATE has the capability to manufacture pcb ranging from basic single sided boards up to forty layers, and provide one stop turnkey services, including pcb manufacture, assembly, components sourcing and function testing.With one-stop solution, high-end product structure, professional product development and manufacturing technology, stable quality performance and well management system,
CESGATE has established long-term and stable cooperate relations with the world's leading communication equipment , aerospace electronics and medical equipment manufacturers.

 

PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green 0PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green 1PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green 2PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green 3PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green 4PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green 5PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green 6

 

FAQ

 

Q: How long does it take for PCB quote?
CESGATE: Normally 12 hours to 48 hours as soon as receive internal engineer evaluate confirmation.
Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”~5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”.
Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.
Q: Can your company provide the serial number when making circuit board text?
CESGATE: Serial numbers can be provided, and in addition to text serial numbers, QR-CODE can also be provided for customers to query.
Q: How long is the shelf life of the PCB board and how should it be stored?
CESGATE: 25℃ / 60%RH is recommended when the PCB is stored. The plate itself has no shelf life, but if it exceeds three months, it needs to be baked to remove moisture and stress, and it should be used immediately after baking. It is recommended that the pieces should be loaded within 6 months of storage to reduce the phenomenon of rejection and explosion.

Contact Details
Kevin

WhatsApp : +8618349393344