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Laser Drilling Machining Broaching PCB Prototype Service Rapid Prototyping

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: ISO9001/ ISO14001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Features: Laser Drilling Product Name: Laser Drilling Machining Broaching PCB Prototype Service Rapid Prototyping
Pad(ring): Min Pad Size For Laser Drillings, Min Pad Size For Mechanical Drillings, Min BGA Pad Size, Pad Size Tolerance Min. Line Spacing: 4mil, 0.003", 0.1mm4mil), 0.1mm, 4/4mil(0.1/0.1mm)
Min. Line Width: 4mil, 0.1mm, 0.1mm/4mi, 0.075mm/0.075mm(3mil/3mil), 3mi Type: Rapid Prototyping, Laser Machining, Milling, Broaching, Etching / Chemical Machining
Keyword: CNC Macining Parts, Aluminum Profile, Prototyping Supplier Rapid Prototyping 2D&3D Drawing Design, Led Pcb Connector, Plastic Prototype Fabrication
High Light:

Laser Drilling PCB Prototype Service

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Machining Broaching Rapid Prototyping

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Rapid PCB Prototype Service

laser drilling Machining Broaching PCB Prototype Service Rapid Prototyping

 

 

PCB Prototype ServiceApplication - Multilayer Board
Multi-layer board: The required circuits are made on the front and back surfaces of multiple double-sided boards, and an insulating layer (Prepreg) is sandwiched between the two double-sided boards and then pressed together to form several layers of copper. The construction of the wire is usually an even number of layers due to the use of multiple double-sided laminates. The number of copper wires that can be made by multi-layer boards is the largest, and it is used in more complex circuits. At present, the motherboards used in computers mostly use eight-layer boards because of too many components. Generally, small electronic products, such as mobile phones, tablet computers, etc. Due to the requirement of small size, at least an eight-layer board is required. The more electronic components, the smaller the product size, and usually more layers of PCB Prototype Service are required.

 

Material:
FR-4 (glass fiber epoxy resin substrate) is the most widely used material in the global electronics industry. FR is a code name for a flame-resistant material grade, which means a material specification that the resin material must be able to self-extinguish after burning. It is not a material name, but a material grade, so there are many types of FR-4 grade materials currently used in general circuit boards, but most of them are four-functional epoxy resin plus filler (Filler) and glass fiber. The composite material made. In recent years, due to the development of electronic product installation technology and PCB Prototype Service technology, FR-4 products with high Tg have appeared again. Tg degree (glass transition temperature - Glass Transition Temperature)

Example: ISOLA FR402, FR408, 370HR South Asia NP-140, NP-155, NP-175

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PCB Prototype service inspection method:

 

PCB Prototype service inspection methods include appearance optical inspection and electrical path test
AOI (Auto Optical Inspection):
It is the automatic optical recognition system. Based on the consideration of production efficiency and inspection accuracy, the use of optical identification instruments to replace manual visual inspection (Visual Inspection) is already a very basic process. The principle of AOI is to first save the standard image file in the device, use the image file to perform optical comparison with the measured object, and automatically determine whether the error of the measured object exceeds the standard. Scrap or repair. Since the circuits on the circuit boards are getting more and more fine, it has already exceeded the limit that can be found by the human eye. Therefore, the AOI equipment of the PCB Prototype is mostly used to check and compare the circuit layers, and compare whether there is too much or too little etching or damage such as collisions.

 

PCB Prototype Service Capacities and Technical Specification

 

NO.

Items

Capabilities

1

Layers

2-68L

2

Maximum machining size

600mm*1200mm

3

Board thickness

0.2mm-6.5mm

4

Copper thickness

0.5oz-28oz

5

Min trace/space

2.0mil/2.0mil

6

Minimum finished aperture

0. 10mm

7

Maximum thickness to diameter ratio

15:1

8

Via treatment

Via, blind&buried via, via in pad, Copper in via …

9

Surface finish/treatment

HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating

10

Base Material

FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)

11

Solder mask color

Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black

12

Testing Service

AOI, X-Ray, Flying-Probe, Function Test, First Article Tester

13

Profiling Punching

Routing,V-CUT,Beveling

14

Bow&twist

≤0.5%

15

HDI type

1+n+1,2+n+2,3+n+3

16

Min mechanical aperture

0.1mm

17

Min laser aperture

0.075mm

 

Application advantages of multilayer circuit boards:
1. High assembly density, small size and light weight, meeting the needs of lightweight and miniaturization of electronic equipment;
2. Due to the high assembly density, the wiring between components (including components) is reduced, the installation is simple, and the reliability is high;
3. Due to the repeatability and consistency of the graphics, wiring and assembly errors are reduced, and equipment maintenance, debugging and inspection time are saved;
4. The number of wiring layers can be increased, thereby increasing design flexibility;
5. It can form a circuit with a certain impedance, and can form a high-speed transmission circuit;
6. The circuit and magnetic circuit shielding layer can be set, and the metal core heat dissipation layer can also be set to meet the needs of special functions such as shielding and heat dissipation.

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FAQ

Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.

Q: Can your company provide the serial number when making circuit board text?
CESGATE: Serial numbers can be provided, and in addition to text serial numbers, QR-CODE can also be provided for customers to query.

Q: How long is the shelf life of the PCB Prototype board and how should it be stored?
CESGATE: 25℃ / 60%RH is recommended when the PCB Prototype is stored. The plate itself has no shelf life, but if it exceeds three months, it needs to be baked to remove moisture and stress, and it should be used immediately after baking. It is recommended that the pieces should be loaded within 6 months of storage to reduce the phenomenon of rejection and explosion.

Q: What is your delivery date?
CESGATE: The general sample delivery time is 6 working days for single and double-sided boards, 7 working days for 4-layer boards, and an additional working day for every 2 layers. However, if there are special processes, additional working days will be added according to the situation.
Generally, the delivery time for mass production is 10 working days for single and double-sided panels, and 15 working days for multi-layer panels. However, if there is a special process or more than a certain number of working days, the working days will be additionally increased according to the situation; you can also pay the urgent fee to shorten the number of days, please contact Contact the business specially proposed, depending on the individual situation to provide expedited days.

Contact Details
Sia

Phone Number : +8618349393344

WhatsApp : +8618349393344