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Led Light Main PCBA Customized 3D Printing High Density Interconnect Circuit

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL, IATF16949, ISO9001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 3-7 working days
Payment Terms: T/T, L/C
Supply Ability: 13kk soldering spot/day
Product Name: Led Light Main PCBA Customized 3D Printing High Density Interconnect Circuit Feature: Customized 3D Printing
High-end Equipment: FUJI NXT3/XPF Laminator Material: FR4/M4/M6/Rogers/TU872/IT968
Lead Time: 3-7 Working Days Test: AOI/SPI/XRAY/First Article Inspection
X-ray: Supported Number Of I/O: IC, SPI, UART/USART
High Light:

Led Light Main PCBA

,

3D Printing Main PCBA

,

High Density Interconnect Circuit PCBA

Led Light Main PCBA Customized 3D Printing High Density Interconnect Circuit

 

Design Procedure of Main PCBA

Manufacturing starts from the fabrication data generated by computer aided design, and component information. The fabrication data is read into the CAM (Computer Aided Manufacturing) software. CAM performs the following functions:

  1. Input of the fabrication data.
  2. Verification of the data
  3. Compensation for deviations in the manufacturing processes (e.g. scaling to compensate for distortions during lamination)
  4. Panelization
  5. Output of the digital tools (copper patterns, drill files, inspection, and others)

 

Led Light Main PCBA Customized 3D Printing High Density Interconnect Circuit 0

 

Solder resist application in Main PCBA

Areas that should not be soldered may be covered with solder resist (solder mask). The solder mask is what gives main PCBA their characteristic green color, although it is also available in several other colors, such as red, blue, purple, yellow, black and white. One of the most common solder resists used today is called "LPI" (liquid photoimageable solder mask).A photo-sensitive coating is applied to the surface of the PWB, then exposed to light through the solder mask image film, and finally developed where the unexposed areas are washed away. Dry film solder mask is similar to the dry film used to image the PWB for plating or etching. After being laminated to the PWB surface it is imaged and developed as LPI. Once but no longer commonly used, because of its low accuracy and resolution, is to screen print epoxy ink. In addition to repelling solder, solder resist also provides protection from the environment to the copper that would otherwise be exposed.

 

Specification

 

NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm

 

 

Advantages of CESGATE:

 

1. Professional component certification engineer
2. Perfect IQC inspection system
3. Assist in improving customer BOM accuracy

4. Solve the problem of R&D samples
5. Professional supply chain team support
6. R&D procurement can also enjoy VIP customer service

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FAQ

 

Q: MOQ?
CESGATE: There is no MOQ in POE. We are able to flexibly handle small and large batches.
Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.

Q: What is your delivery date?
CESGATE: The general sample delivery time is 6 working days for single and double-sided boards, 7 working days for 4-layer boards, and an additional working day for every 2 layers. However, if there are special processes, additional working days will be added according to the situation.
Generally, the delivery time for mass production is 10 working days for single and double-sided panels, and 15 working days for multi-layer panels. However, if there is a special process or more than a certain number of working days, the working days will be additionally increased according to the situation; you can also pay the urgent fee to shorten the number of days, please contact Contact the business specially proposed, depending on the individual situation to provide expedited days.

Q: Can you give us a preferential discount?
CESGATE: Of course, we will offer a preferential discount for your large orders and confirm the order quickly.

Contact Details
Yvonne

Phone Number : +8615508119290

WhatsApp : +8618349393344