Reflow Soldering ISO Certification Turn Key Assembly Main PCBA Rigid Flex

Reflow Soldering ISO Certification Turn-key Assembly Main PCBA Rigid-Flex

DFM / DFA Check

Once a turnkey order is released to CESGATE’s production team, their very first task is the validate the design through a thorough DFM / DFA Check process. These checks include verification of consistency across different design documents (i.e. BoM, Gerbers, Centroid, etc.), part spacing, footprint accuracy, and clear orientation markings. The main objective of this procedure is to minimize as much as possible the potential for design errors to affect the finished product, which acts to protect CESGATE’s clients against the additional time and cost involved with board-level rework.

Clients should watch for emails from CESGATE’s production team over course of the first one or two days after placing an order. If any issues or discrepancies are detected during this initial check, the production coordinator for the order in question will reach out to the client directly for resolution. Generally, an itemized report will be sent for response, and the order will be placed on hold pending full confirmation, so it is important to reply to these questions as soon as possible in order to avoid delays.

Incoming Material Inspection

CESGATE’s Parts Procurement team works concurrently with our PCB Fabrication team to ensure that all assembly materials are received and ready for use as soon as the bare PCBs are ready for assembly. As parts are received at CESGATE’s production facility, our Incoming Quality Control (IQC) team conducts a thorough inspection before warehousing any particular material or component. Inspections include sample operational testing as well as date code verification and entry into a software material management system. Our sophisticated software management system ensures that rules of first-in-first-out are strictly followed, and that parts used in PCB Assembly are always in good working order.

The combined efforts of CESGATE’s IQC and Parts Procurement teams ensure that all parts used in PCB assembly are of the highest quality so that our clients can be confident in the overall shelf-life of their products.

Main PCBA Application - Multilayer Board

Multi-layer board: The required circuits are made on the front and back surfaces of multiple double-sided boards, and an insulating layer (Prepreg) is sandwiched between the two double-sided boards and then pressed together to form several layers of copper. The construction of the wire is usually an even number of layers due to the use of multiple double-sided laminates. The number of copper wires that can be made by multi-layer boards is the largest, and it is used in more complex circuits. At present, the motherboards used in computers mostly use eight-layer boards because of too many components. Generally, small electronic products, such as mobile phones, tablet computers, etc. Due to the requirement of small size, at least an eight-layer board is required. The more electronic components, the smaller the product size, and usually more layers of Main PCBA are required.
 

1. Material
FR-4 (glass fiber epoxy resin substrate) is the most widely used material in the global electronics industry. FR is a code name for a flame-resistant material grade, which means a material specification that the resin material must be able to self-extinguish after burning. It is not a material name, but a material grade, so there are many types of FR-4 grade materials currently used in general circuit boards, but most of them are four-functional epoxy resin plus filler (Filler) and glass fiber. The composite material made. In recent years, due to the development of electronic product installation technology and Main PCBA technology, FR-4 products with high Tg have appeared again. Tg degree (glass transition temperature - Glass Transition Temperature)

Example: ISOLA FR402, FR408, 370HR South Asia NP-140, NP-155, NP-175

Technical Requirement for main pcba:

1. Professional Surface-mounting and Through-hole soldering Technology

2. Various sizes like 1206, 0805, 0603 components SMT technology

3. ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4. Main PCBA With CE, FCC, Rohs Approval

5. Nitrogen gas reflow soldering technology for SMT.

6. High Standard SMT&Solder Assembly Line

7. High density interconnected board placement technology capacity.

Specification

FAQ