OEM ODM Prototype Quick Turn RF PCB Board UL CE FCC Rohs Customized Logo

OEM ODM Prototype Quick Turn RF PCB Board UL CE FCC Rohs Customized Logo

What is a Printed Circuit Board (PCB)

Printed circuit board, also known as printed circuit board, printed circuit board, often used in English abbreviations are PCB (Printed circuit board) or PWB (Printed wire board). PCB is the base plate used to assemble electronic components, and it is also the "mother of electronic products". It is a very important electronic component and a support for electronic components. Mainly through the metal copper foil circuits on the board, through the design of each layer to connect and conduct related components, to achieve a complete product that operates effectively.

Before the early PCB appeared, the various components of electronic products were connected by wires to form a complete path. Later, in order to simplify the manufacturing process of electronic products and reduce the cost, the circuit was developed by printing, and the copper foil on the substrate was used to replace the original wire connection, thereby improving the production efficiency.

The various components are mainly connected through the metal copper foil circuits on the board. By designing each layer to connect and conduct related components, a complete product that operates effectively is achieved.

The traditional circuit board construction method uses printed resists to make circuit lines and drawings, so it is called printed circuit board. Because the size of electronic products continues to be miniaturized and refined, most circuit boards are currently covered with etching resists (wet film or dry film), which are exposed and developed and then etched to remove unwanted copper foil to make circuit boards.

Special RF PCB Board Type:

1. FPC (Flexible Printed Circuit)

The flexible board is made of a soft plastic base film, copper foil and adhesive, which can be freely bent and flexible. It is thin and light, with high precision. It can have multi-layer circuits and attach chips to the board. or SMT wafers. It is generally called a flexible printed circuit board, abbreviated as a flexible board, and other names such as flexible circuit boards, soft films, flex boards, etc.
Like other substrates, FPCs continue to pursue higher line density and number of layers to improve FPC performance and reduce transmission power consumption. However, the manufacturing process of FPCs is very complex, and the technical capabilities required in electronic components are relatively high.

The application of FPC is very extensive. It can be said that as long as it is used in technological products, FPC is most commonly used in communication products such as smart phones. In addition, there are notebooks, automotive electronics, medical, military and wearable devices, etc. As modern products pursue light, thin and short, flexible boards have also become very important. According to statistics, the number of FPCs used in the iPhone X accounts for about 20 pieces. In addition to the iPhone, these FPCs play the following roles in terminal equipment: antenna FPCs, backlight module FPCs, camera lens FPCs, Touch screen soft board, Touch ID soft board, sim card soft board, laptop screen connection soft board, car image sensor soft board, car light group soft board, etc., we can see the importance of soft board.

Flexible boards are divided into PI, MPI, and LCP by material. MPI is the modified PI. PI is almost eliminated because of its poor performance. Now the main materials used for flexible boards are MPI and LCP, and the performance of LCP is higher than that of MPI. , The relative price has also increased significantly. In terms of cost performance, it is generally believed that MPI is relatively high, especially in recent years, the performance of MPI has been greatly improved, and it has further threatened LCP. As in 2018, Apple also decided to replace some LCP soft boards with MPI soft boards. reduce costs. The biggest consideration factor in the use of the three types of flexible boards is the transmission loss. In the case of low frequency transmission, the loss of the three is not significantly different. However, as the frequency increases, the loss of PI gradually increases, and the loss of MPI and LCP also has a greater difference. , so in the case of higher frequency, the advantages of LCP will be more obvious. It can be seen that in the 5G era, some of our transmission frequencies will be greatly increased to above 24GHz, and there will be higher requirements for the quality of the soft board. .

Metal Core RF PCB Board Manufacturing Customized RF PCB Board Rigid Printed Circuit Boards

CESGATE's products are widely used in consumer electronics, computers, communication engineering, power technology, industrial control, security monitoring, medical equipment, instrumentation, automotive electronics, military aerospace, artificial intelligence, LED lighting and display screens. CESGATE's products have been exported to Europe, America and Asia, serving more than 200 countries around the world and serving more than 100,000 users.

What CESGATE provide?
1. Reasonable and competitive price
2. Provide component selection service for customers, including alternative component selection service for out of stock components
3. Expedited service is supported for those urgent orders
4. Complete after-sales services

CESGATE provide one-stop PCB/PCBA customization services. To meet all of customer's PCB/PCBA requirement is Intech circuit service's goal

To offer good quality PCB/PCBA to our customer, we will do many kind of testing to ensure quality before shipment

Outgoing test to check min PTH Cu thickness, Min surface Cu thickness, ENIG Au data,Ni data, Au layer adhesion testing, soldermask adhesion testing, silkscreen adhesion testing, Thermal stress testing, hardness testing, Twist testing, Bow testing

Microsection testing to check hole Cu thickness, Surface Copper thickness, Wrap copper thickness, Hole Wall Integrity, soldermask thickness and stack up.

E-test to check any open/short circuit.

Thermal Stress Test to avoid any Delamination, Measling and others.

Solderability of PTH to avoid any discolor, Wrinkles, Blisters, Measling, Blow-Hole, Solermask peel off, and soldermask filled in hole-wall incompletely.

Impedance testing, and so on……

PCB Capacities and Technical Specification

Advanced PCB Manufacturing and PCB Assembly Equipment

CESGATE has imported the advanced machinery from US,Japan,German and Israel to improve our production and technical ability.We have set a great example the PCB field of flying probe testing,buried and blind via and special controlled impedance.We have a highly developed R&D division which has helped our factory successfully produce mechanical micro via,high density impedance and HDI.

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