|Place of Origin:||China|
|Minimum Order Quantity:||1PCS( NO MOQ)|
|Price:||Negotiable (Depends on your GERBER and BOM)|
|Packaging Details:||PCB: Vacuum Packing / PCBA: ESD Packing|
|Delivery Time:||1-30 working days|
|Payment Terms:||T/T, L/C|
|Product Name:||Prototype Pcb Board 8 Bit Microcontrollers Operational Amplifier Chip Logic Gates||Buildings:||Prototype Pcb Board|
|Pad(ring):||Min Pad Size For Laser Drillings, Min Pad Size For Mechanical Drillings, Min BGA Pad Size, Pad Size Tolerance||Min. Line Spacing:||4mil, 0.003", 0.1mm4mil), 0.1mm, 4/4mil(0.1/0.1mm)|
|Min. Line Width:||4mil, 0.1mm, 0.1mm/4mi, 0.075mm/0.075mm(3mil/3mil), 3mi||Min. Hole Size:||0.2mm, 8 Mil, 0.10mm, 3mil (0.075mm), 0.004"|
|MOQ:||Small Orders Accepted||Color:||As Per Customer's Requirement, Multi Colors, Color Availale, Customzied, Optional|
Prototype Pcb Board 8Bit Microcontrollers,
0.2mm Prototype Pcb Board
Prototype Pcb Board 8 Bit Microcontrollers Operational Amplifier Chip Logic Gates
What is a Printed Circuit Board (PCB)
Printed circuit board, also known as printed circuit board, printed circuit board prototype, often used in English abbreviations are PCB (Printed circuit board) prototype or PWB (Printed wire board). PCB is the base plate used to assemble electronic components, and it is also the "mother of electronic products". It is a very important electronic component and a support for electronic components. Mainly through the metal copper foil circuits on the board, through the design of each layer to connect and conduct related components, to achieve a complete product that operates effectively.
Before the early PCB appeared, the various components of electronic products were connected by wires to form a complete path. Later, in order to simplify the manufacturing process of electronic products and reduce the cost, the circuit was developed by printing, and the copper foil on the substrate was used to replace the original wire connection, thereby improving the production efficiency.
The various components are mainly connected through the metal copper foil circuits on the board. By designing each layer to connect and conduct related components, a complete product that operates effectively is achieved.
The traditional circuit board construction method uses printed resists to make circuit lines and drawings, so it is called printed circuit board prototype. Because the size of electronic products continues to be miniaturized and refined, most circuit boards are currently covered with etching resists (wet film or dry film), which are exposed and developed and then etched to remove unwanted copper foil to make circuit boards.
|2||Maximum machining size||600mm*1200mm|
|6||Minimum finished aperture||0. 10mm|
|7||Maximum thickness to diameter ratio||15:1|
|8||Via treatment||Via, blind&buried via, via in pad, Copper in via …|
|9||Surface finish/treatment||HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating|
|10||Base Material||FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
|11||Solder mask color||Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black|
|12||Testing Service||AOI, X-Ray, Flying-Probe, Function Test, First Article Tester|
|16||Min mechanical aperture||0.1mm|
|17||Min laser aperture||0.075mm|
|Q: What is your delivery date?
CESGATE: The general sample delivery time is 6 working days for single and double-sided boards, 7 working days for 4-layer boards, and an additional working day for every 2 layers. However, if there are special processes, additional working days will be added according to the situation.
Generally, the delivery time for mass production is 10 working days for single and double-sided panels, and 15 working days for multi-layer panels. However, if there is a special process or more than a certain number of working days, the working days will be additionally increased according to the situation; you can also pay the urgent fee to shorten the number of days, please contact Contact the business specially proposed, depending on the individual situation to provide expedited days.
|Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
|Q: What are the types of solder mask?
CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type.