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Rogers Ro4003c RF PCB Board Sap Bill Of Material Transaction Sage 50 Bom

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL、IATF16949、ISO9001
Model Number: N/A
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 working days
Payment Terms: T/T, L/C
Supply Ability: 30,000pcs/month
Product Name: Rogers Ro4003c RF PCB Board Sap Bill Of Material Transaction Sage 50 Bom Feature: Sage 50 Bom
Material:: Aluminum,Brass,Bronze,Copper,Stainless Steel Product Name:: EMI Shielding Can / RF Shield Can / Shield Case
Drawing Format:: 2D/(PDF/CAD)3D(IGES/STEP) Surface Treatment:: Colour Anodize,Galvanized,Powder Coating,Chrome Plating...
Material: FR4 CEM1 CEM3 Hight TG
High Light:

Ro4003c RF PCB Board

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Sage 50 Bom RF PCB Board

Rogers Ro4003c RF PCB Board Sap Bill Of Material Transaction Sage 50 Bom

 

Metal Core PCB Manufacturing Customized PCB Rigid Printed Circuit Boards

 

CESGATE with customers to provide them with the highest-quality PCB and PCBA electronic manufacturing services to achieve their goals. Our flexibility is in meeting customer requirements and our superior customer service. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly.We provide one-stop electronic manufacturing service to help you qualify your designs and provide quality samples to your customers.

 

PCB characteristics:

1. High wiring density, small size and light weight, which is conducive to the miniaturization of electronic equipment.

2. Due to the repeatability and consistency of the graphics, errors in wiring and assembly are reduced, and equipment maintenance, debugging and inspection time are saved.

3. It is conducive to mechanized and automated production, improving labor productivity and reducing the cost of electronic equipment.

4. The design can be standardized and easy to exchange.RF PCB Board is the abbreviation of Printed Circuit Board, translated into Chinese called printed circuit board, because it is made by electronic printing, so it is called "printed" circuit board. PCB is an important electronic component in the electronics industry, a support for electronic components, and a carrier for electrical connection of electronic components. PCB has been widely used in the manufacture of electronic products. 

 

Consumer electronics products:

Printed circuit boards are mainly composed of insulating substrates and conductors, which play the role of support, interconnection and part of circuit elements in electronic equipment. Electronic components such as integrated circuits, resistors, capacitors, etc. cannot function as a single entity. They only work as a whole if they have a firm foothold on the RF PCB Boardand there are conductive junctions connecting them. The printed circuit board is the skeleton that supports the components and is the conduit for connecting electrical signals. In addition, some printed circuit boards have components such as resistors, capacitors, inductors, etc., which become functional circuits and play the role of trachea.The role of printed circuit boards in electronic equipment is to provide mechanical support for fixing and assembling for transistors, integrated circuits, resistors, capacitors, inductors and other components; to realize the integration of transistors, integrated circuits, resistors, capacitors, inductors and other components. Wiring and electrical connection and electrical insulation between components meet their electrical characteristics; provide identification characters and graphics for the inspection and maintenance of components in the electronic assembly process, and provide solder resist graphics for wave soldering.

 

PCB Capacities and Technical Specification

 

NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm


 

Advanced PCB Manufacturing and PCB Assembly Equipment

 

CESGATE has imported the advanced machinery from US,Japan,German and Israel to improve our production and technical ability.We have set a great example the RF PCB Board  field of flying probe testing,buried and blind via and special controlled impedance.We have a highly developed R&D division which has helped our factory successfully produce mechanical micro via,high density impedance and HDI.

 

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FAQ:

 

Q: Do you support fast proofing?
CESGATE: Yes, we support fast proofing within 3-7 days.
Q: What does CESGATE need for a customized PCB order?
CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products.
Q: How about the shipping cost?
CESGATE: The Shipping cost depends on the destination, the weight and volume of the goods as well as the quotation of DHL/FEDEX/ freight forwarder at that time. You can inform us of the transportation way you need before placing an order.
Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”~5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”.

 

 

 

 

 

 

 

Contact Details
Yvonne

Phone Number : +8615508119290

WhatsApp : +8618349393344