|Place of Origin:||China|
|Minimum Order Quantity:||1PCS( NO MOQ)|
|Price:||Negotiable (Depends on your GERBER and BOM)|
|Packaging Details:||PCB: Vacuum Packing / PCBA: ESD Packing|
|Delivery Time:||1-30 working days|
|Payment Terms:||T/T, L/C|
|Product Name:||Bldc Fan Circuit Board Smt Control Board PCB Prototype Service Sap Pm Bom||Type:||Rapid Prototyping, Other Machining Services, Rapid Prototyping|
|Optional Service:||3 4 5 6 Axis CNC Machining Service||Min. Line Spacing:||4mil, 0.003", 0.1mm4mil), 0.1mm, 4/4mil(0.1/0.1mm)|
|Min. Line Width:||4mil, 0.1mm, 0.1mm/4mi, 0.075mm/0.075mm(3mil/3mil), 3mi||Min. Hole Size:||0.2mm, 8 Mil, 0.10mm, 3mil (0.075mm), 0.004"|
|Drawing Format:||2D(PDF/CAD) And 3D(IGES/STEP)||Application:||Consumer Electronics, Power, Automotive, Industry, Electronic Product|
2D 3D Bldc Fan Circuit Board,
Bldc Fan Circuit Board 600mm*1200mm,
PCB Prototype Service 600mm*1200mm
Bldc Fan Circuit Board Smt Control Board PCB Prototype Service Sap Pm Bom
|2||Maximum machining size||600mm*1200mm|
|6||Minimum finished aperture||0. 10mm|
|7||Maximum thickness to diameter ratio||15:1|
|8||Via treatment||Via, blind&buried via, via in pad, Copper in via …|
|9||Surface finish/treatment||HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating|
|10||Base Material||FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
|11||Solder mask color||Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black|
|12||Testing Service||AOI, X-Ray, Flying-Probe, Function Test, First Article Tester|
|16||Min mechanical aperture||0.1mm|
|17||Min laser aperture||0.075mm|
Q: What are the common substrates of CESGATE?
|Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
CESGATE: There is no MOQ in POE. We are able to flexibly handle small and large batches.
|Q: Can you give us a preferential discount?
CESGATE: Of course, we will offer a preferential discount for your large orders and confirm the order quickly.
|Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.
|Q: What modes of transport are there?
CESGATE: Usually includes express, air shipment, rail shipment and sea shipment.