| Place of Origin: | China |
|---|---|
| Brand Name: | CESGATE |
| Certification: | UL、IATF16949、ISO9001 |
| Model Number: | NA |
| Minimum Order Quantity: | 1PCS( NO MOQ) |
| Price: | Negotiable (Depends on your GERBER and BOM) |
| Packaging Details: | PCB: Vacuum Packing / PCBA: ESD Packing |
| Delivery Time: | 3-7 working days |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 13kk solding spot/day |
| Product Name: | Small Volume Quick Prototype Turnkey PCB Assembly Printed Circuit Assembly | Feature: | Quick Prototype |
|---|---|---|---|
| High-end Equipment: | FUJI NXT3/XPF Laminator | Material: | FR4/M4/M6/Rogers/TU872/IT968 |
| Test: | AOI/SPI/XRAY/First Article Inspection | QTY: | Support Prototype And Batch Production |
| Samples: | Supported | Application: | Consumer Electronics, Electronic Sensor, Solar Panels Pcb, Rigid Fpc, Electronic Products |
| High Light: | Quick Prototype Turnkey PCB Assembly,M6 Turnkey PCB Assembly |
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Small Volume Quick Prototype Turnkey PCB Assembly Printed Circuit Assembly
Types and uses of PCBs
(A) 4-layer board
The substrate material is mainly epoxy glass fiber cloth. The main uses are personal computers, medical electronic equipment, measuring instruments, semiconductor testing machines, numerical control machines, electronic switches, communication machines, memory circuit boards, IC cards, etc.
(B) 6-8 layer board
The substrate material is still mainly epoxy resin glass fiber cloth. Most of them are used in electronic switches, semiconductor testing machines, mid-range personal computers, engineering workstations and other machines.
(C) 10 layers or more
The material is mainly glass benzene resin material, or epoxy resin is used as the multi-layer PCB substrate material. The application of this type of PCB is special, and it is used in large industrial computers, high-speed computers, defense machines, communication machines, etc.
CESGATE's advantages of turnkey PCB assembly
1. As a one-stop service shop, thoughtful Turnkey PCB Assembly will start from your inquiry to after-sales.
2. Free design stack-up service, modify until you are satisfied.
3. Each process is monitored by specialized quality inspection personnel to detect problems in time and solve them as soon as possible.
4. Expedited service is supported.
5. Turnkey PCB Assembly
Specification
| Article | Description | Capability |
| Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
| Board Cutting | Number of layers | 1-48 |
| Min.thickness for inner layers (Cu thickness are excluded) |
0.003”(0.07mm) | |
| Board Thickness | Standard | (0.1-4mm±10%) |
| Min. | Single/Double:0.008±0.004” | |
| 4layer:0.01±0.008” | ||
| 8layer:0.01±0.008” | ||
| Bow and twist | no more than 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z | |
| Drilling | Min size | 0.0078”(0.2mm) |
| Drill deviation | ±0.002″(0.05mm) | |
| PTH hole tolerance | ±0.002″(0.005mm) | |
| NPTH hole tolerance | ±0.002″(0.005mm) | |
| Solder Mask | Color | Green,white,black,red,blue… |
| Min solder mask clearanace | 0.003″(0.07mm) | |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | white,black,yellow,blue… |
| Min size | 0.006″(0.15mm) | |
| Max Size of Finish Board | 700*460mm | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
| PCB Outline | Square,circle,irregular(with jigs) | |
| Package | QFN,BGA,SSOP,PLCC,LGA | |
RFQ:
| Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board? CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”～5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”. |
| Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board? CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material. |
| Q: Can your company provide the serial number when making circuit board text? CESGATE: Serial numbers can be provided, and in addition to text serial numbers, QR-CODE can also be provided for customers to query. |
| Q: How long is the shelf life of the PCB board and how should it be stored? CESGATE: 25℃ / 60%RH is recommended when the PCB is stored. The plate itself has no shelf life, but if it exceeds three months, it needs to be baked to remove moisture and stress, and it should be used immediately after baking. It is recommended that the pieces should be loaded within 6 months of storage to reduce the phenomenon of rejection and explosion. |
FAQ
