Place of Origin: | China |
---|---|
Brand Name: | CESGATE |
Certification: | UL、IATF16949、ISO9001 |
Model Number: | NA |
Minimum Order Quantity: | 1PCS( NO MOQ) |
Price: | Negotiable (Depends on your GERBER and BOM) |
Packaging Details: | PCB: Vacuum Packing / PCBA: ESD Packing |
Delivery Time: | 3-7 working days |
Payment Terms: | T/T, L/C |
Supply Ability: | 13kk solding spot/day |
Product Name: | Electronic Circuit Board Fr4 Multilayer Turnkey PCB Assembly Active Prototype IC | Feature: | Fr4 |
---|---|---|---|
High-end Equipment: | FUJI NXT3/XPF Laminator | Material: | FR4/M4/M6/Rogers/TU872/IT968 |
Lead Time: | 3-7 Working Days | Testing Service: | AOI X-Ray Function Test |
Warranty: | 3 Months | Packing: | Reel/Tube/Tray/Box |
High Light: | Easyeda Esp32 Turnkey PCB Assembly,Fr4 Tg170 Turnkey PCB Assembly |
Electronic Circuit Board Fr4 Multilayer Turnkey PCB Assembly Active Prototype IC
HDI boards have the following advantages:
1. Can reduce PCB cost. When the PCB density increases beyond eight layers, it is manufactured by HDI and its cost will be lower than the traditional complex pressing process.
2. Increase circuit density, interconnection of traditional circuit boards and parts
3. Promote the use of advanced building techniques
4. Has better electrical performance and signal accuracy
5. Better reliability
6, can improve thermal performance
7. Can improve RFI/EMI/ESD (RFI/EMI/ESD)
Often encountered materials in PCB assembly service
Specification
Article | Description | Capability |
Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
Board Cutting | Number of layers | 1-48 |
Min.thickness for inner layers (Cu thickness are excluded) |
0.003”(0.07mm) | |
Board Thickness | Standard | (0.1-4mm±10%) |
Min. | Single/Double:0.008±0.004” | |
4layer:0.01±0.008” | ||
8layer:0.01±0.008” | ||
Bow and twist | no more than 7/1000 | |
Copper Weight | Outer Cu weight | 0.5-4 0z |
Inner Cu weight | 0.5-3 0z | |
Drilling | Min size | 0.0078”(0.2mm) |
Drill deviation | ±0.002″(0.05mm) | |
PTH hole tolerance | ±0.002″(0.005mm) | |
NPTH hole tolerance | ±0.002″(0.005mm) | |
Solder Mask | Color | Green,white,black,red,blue… |
Min solder mask clearanace | 0.003″(0.07mm) | |
Thickness | (0.012*0.017mm) | |
Silkscreen | Color | white,black,yellow,blue… |
Min size | 0.006″(0.15mm) | |
Max Size of Finish Board | 700*460mm | |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
PCB Outline | Square,circle,irregular(with jigs) | |
Package | QFN,BGA,SSOP,PLCC,LGA |
Company Introduction
CESGATE is a team with more than 10 years experience in the field. We owns abundant experiences for serving overseas customers from industrial automatic control, communication, medical, Auto and consumer electronics,etc. We test our product strictly to guarantee the quality to our customers. We accumulate high reputation during our cooperation.You will achieve following value-added services when you cooperate with us:
One-stop PCB/PCBA Service
Optimizing your PCB design during production
Satisfied quality with competitive prices
Instant response in both quotation and delivery
Increase your business with our powerful support
FAQ
Q: What certificates do you have? CESGATE: We have ISO 9001, ISO14001 and UL certificates. |
Q: Why choose us? CESGATE: Professional and experienced R&D team. Advanced production equipment, scientific and reasonable process flow. Reliable and strict quality control system. We test all our products before shipment to make sure everything is in perfect condition. |
Q: What does CESGATE need for a customized PCB order? CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products. |
Q: What are the types of solder mask? CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type. |
Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board? CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material. |