|Place of Origin:||China|
|Minimum Order Quantity:||1PCS( No MOQ)|
|Price:||Negotiable (Depends on your BOM)|
|Packaging Details:||Customized cartons according to product size and weight, with crashproof foam|
|Delivery Time:||1-2 working days|
|Payment Terms:||T/T, L/C|
|Supply Ability:||10,0000PCS per day|
|Product Name:||Emu8086 PCB Electronic Components Exclude From Bom Solidworks Altium Designer 20||Feature:||SMT/BOM|
|Quality:||100% New Original Guarantee||Part Status:||Active|
|Source:||Major Global Authorized Distributors||Manufacturer:||Any|
|Surface Finishing:||HASL Lead Free|
Emu8086 PCB Electronic Components,
HASL Lead Free PCB Electronic Components
Emu8086 PCB Electronic Components Exclude From Bom Solidworks Altium Designer 20
1. Can reduce PCB cost. When the PCB density increases beyond eight layers, it is manufactured by HDI and its cost will be lower than the traditional complex pressing process.
2. Increase circuit density, interconnection of traditional circuit boards and parts
3. Promote the use of advanced building techniques
4. Has better electrical performance and signal accuracy
5. Better reliability
6, can improve thermal performance
7. Can improve RFI/EMI/ESD (RFI/EMI/ESD)
8. Improve design efficiency
HDI boards are widely used in mobile phones, digital cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are typically fabricated using a build-up method. The longer the settling time, the higher the technical grade of the board. Regular HDI boards are basically disposable. High-end HDIs use two or more build techniques. At the same time, advanced PCB components technologies such as stacked holes, plated hole filling and laser direct drilling are used. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.
Lead-time for PCB Components Sourcing
This is the duration required to manufacture a component. It includes order preparation, queue, setup, run, inspection and put-away time.
For products made on an order, it’s the time taken from the release of an order, to production and shipment.
Escalating lead time is one of the emerging trends in Electronic component sourcing. This creates a big challenge for purchasing communities.
There is usually no stability when it comes to lead times.
Escalating lead times is a complicated situation rising due to market demands, investment constraints and capacity allocations in some regions.
Lead-time usually is between 5- 8 working days from the initial day of order. For mass production lead time can take up to 2 weeks.
However, this may differ from one region to the other. For example, Lead times for resistors in North America had moved from 12 to 16 weeks by the beginning of 2017.
Your Reliable Component Sourcing Supplier
1. 1600 square meters central warehouse
2. Full range of Yageo, Murata, Avx, Kemet RC
3. Temperature and humidity control, first in first out mechanism
4. Strict supplier access system
5. Strict supplier audit mechanism
6. Annual Supplier Audit Mechanism
|Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
CESGATE: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.
|Q: What certificates do you have?
CESGATE: We have ISO 9001, ISO14001 and UL certificates.
|Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.