Send Message

High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL、IATF16949、ISO9001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 3-7 working days
Payment Terms: T/T, L/C
Supply Ability: 13kk solding spot/day
Product Name: High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III Feature: Thermal Profiles
SMT Production Line: 14 High-end Equipment: FUJI NXT3/XPF Laminator
Material: FR4/M4/M6/Rogers/TU872/IT968 Max Size Of Finish Board: 700*460mm
Test: AOI/SPI/XRAY/First Article Inspection Base Material: FR-4, FR4/CEM-1/Aluminum/CEM-3, High TG, FR-4 Epoxy Resin, FR-4/aluminum /cem-3/FR-1
High Light:

Build Thermal Profiles Turnkey PCB Assembly

,

IPC Class III Turnkey PCB Assembly

High frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III

 

 

CESGATE's advantages of turnkey PCB assembly

 

As IATF16949 verified circuit board factory, CESGATE will provide DFM Analysis for your every order , as well as low volume and medium volume production runs. We verify all details of your files, including Gerber files, to allow you to correct your PCB design before manufacturing, saving significant time and cost.
We use ERP and MES system, which can protect all your project files and also control all the parts quality from the beginning to the end . As a PCB manufacturer, we have complete and mature tracking system by the two systems, which can solve the problems quickly, also guarantees on-time delivery of quick turn printed circuit board.

 

 

Rigid-flex board refers to pressing the flexible circuit board and the rigid circuit board together according to the relevant process requirements during PCB proofing to form a circuit board with FPC characteristics and PCB characteristics; its price is relatively high, but its use Extremely broad and can be tailored for applications in many industries. So, under what circumstances does PCB proofing need to use rigid-flex board?
1. High impact and high vibration environment. The rigid-flex board has strong impact resistance and can be used in high stress environments to ensure stable performance of the equipment, otherwise it will cause equipment failure.
2. High-precision applications where reliability is more important than cost considerations. If a cable or connector failure is dangerous, it is better to use a more durable flex-rigid board.
3. High density applications. Some components lack the surface area required for all necessary connectors and cables. In this case, using a flexible rigid board can save space to solve this problem.
4. Applications requiring multiple rigid boards. When more than four connection boards are included in the Turnkey PCB Assembly, replacing them with a single rigid-flex board may be the best option and more cost-effective.

 

 

CESGATE advantages?

 

In the PCB industry for more than ten years, a standardized and rigorous process and system has been established to effectively reduce quality problems

 

 

Specification

 

Article Description Capability
Material Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC...
Board Cutting Number of layers 1-48
Min.thickness for inner layers
(Cu thickness are excluded)
0.003”(0.07mm)
Board Thickness Standard (0.1-4mm±10%)
Min. Single/Double:0.008±0.004”
4layer:0.01±0.008”
8layer:0.01±0.008”
Bow and twist no more than 7/1000
Copper Weight Outer Cu weight 0.5-4 0z
Inner Cu weight 0.5-3 0z
Drilling Min size 0.0078”(0.2mm)
Drill deviation ±0.002″(0.05mm)
PTH hole tolerance ±0.002″(0.005mm)
NPTH hole tolerance ±0.002″(0.005mm)
Solder Mask Color Green,white,black,red,blue…
Min solder mask clearanace 0.003″(0.07mm)
Thickness (0.012*0.017mm)
Silkscreen Color white,black,yellow,blue…
Min size 0.006″(0.15mm)
Max Size of Finish Board 700*460mm
Surface Finish HASL,ENIG,immersion silver,immersion tin,OSP…
PCB Outline Square,circle,irregular(with jigs)
Package QFN,BGA,SSOP,PLCC,LGA

 

 

 

 

High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III 0High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III 1High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III 2High Frequency Box Build Thermal Profiles Turnkey PCB Assembly IPC Class III 3

 

 

FAQ

 

 

Q: Do you support fast proofing?
CESGATE: Yes, we support fast proofing within 3-7 days.
Q: Are my files safe?
CEGSATE: Your files are kept very safe, and we are protecting intellectual property for our clients throughout the process. All files provided by customers are never shared with any third party.
Q: MOQ?
CESGATE: There is no MOQ in POE. We are able to flexibly handle small and large batches.
Q: Do you have any other services?
CESGATE: We mainly focus on the procurement services of PCB + Turnkey PCB Assembly+ components. In addition, we can also provide programming, testing, cable, housing Turnkey PCB Assembly services.
Q: What is your inspection policy? How do you control the quality?
CESGATE: In order to ensure the quality of PCB products, flying probe inspection is usually used; electrical fixtures, automatic optical inspection (AOI), BGA parts x-ray inspection, first article inspection ( FAI) etc.

Contact Details
Sia Li

Phone Number : +86 18349393344

WhatsApp : +8618349393344