Aluminium Circuit Board PCB Assembly Service Rogers Fr4 Prototype Soldering

Aluminium Circuit Board PCB Assembly Service Rogers Fr4 Prototype Soldering

Copper patterning

In PCB assembly service,The first step is to replicate the pattern in the fabricator's CAM system on a protective mask on the copper foil PCB layers. Subsequent etching removes the unwanted copper unprotected by the mask. (Alternatively, a conductive ink can be ink-jetted on a blank (non-conductive) board. This technique is also used in the manufacture of hybrid circuits.)

1. Silk screen printing uses etch-resistant inks to create the protective mask.
2. Photoengraving uses a photomask and developer to selectively remove a UV-sensitive photoresist coating and thus create a photoresist mask that will protect the copper below it. Direct imaging techniques are sometimes used for high-resolution requirements. Experiments have been made with thermal resist. A laser may be used instead of a photomask. This is known as maskless lithography or direct imaging.
3. PCB milling uses a two or three-axis mechanical milling system to mill away the copper foil from the substrate. A PCB milling machine (referred to as a 'PCB Prototyper') operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling head in the x, y, and (if relevant) z axis.
4. Laser resist ablation Spray black paint onto copper clad laminate, place into CNC laser plotter. The laser raster-scans the PCB and ablates (vaporizes) the paint where no resist is wanted. (Note: laser copper ablation is rarely used and is considered experimental.
5. Laser etching The copper may be removed directly by a CNC laser. Like PCB milling above this is used mainly for prototyping.
6. EDM etching uses an electrical discharge to remove a metal from a substrate submerged into a dielectric fluid

The method chosen depends on the number of boards to be produced and the required resolution.

Lamination in PCB assembly service

INATIONMulti-layer printed circuit boards have trace layers inside the board. This is achieved by laminating a stack of materials in a press by applying pressure and heat for a period of time. This results in an inseparable one piece product. For example, a four-layer PCB assembly service can be fabricated by starting from a two-sided copper-clad laminate, etch the circuitry on both sides, then laminate to the top and bottom pre-preg and copper foil. It is then drilled, plated, and etched again to get traces on top and bottom layers.

The inner layers are given a complete machine inspection before lamination because mistakes cannot be corrected afterwards. Automatic optical inspection (AOI) machines compare an image of the board with the digital image generated from the original design data. Automated Optical Shaping (AOS) machines can then add missing copper or remove excess copper using a laser, reducing the number of PCBs that have to be discarded. PCB tracks can have a width of just 10 micrometers.

 
Specification

Strengths of CESGATE

1. Provide full BOM component supply and part selection
2. From the original factory and the first-level agents, the original authentic guarantee
3. More than 50,000 kinds of components are always in stock
4. Customers can buy on demand, no need to buy the whole package

5. Nitrogen gas reflow soldering technology for SMT.

6. High Standard SMT&Solder Assembly Line

7. High density interconnected board placement technology capacity.

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