|Place of Origin:||China|
|Certification:||UL, IATF16949, ISO9001|
|Minimum Order Quantity:||1PCS( NO MOQ)|
|Price:||Negotiable (Depends on your GERBER and BOM)|
|Packaging Details:||PCB: Vacuum Packing / PCBA: ESD Packing|
|Delivery Time:||3-7 working days|
|Payment Terms:||T/T, L/C|
|Supply Ability:||13kk soldering spot/day|
|Product Name:||OEM And ODM Electronic Control Board PCB Assembly Service Customized Logo||Feature:||OEM And ODM|
|Min Package:||03015||Profiling Punching:||Routing/V-CUT/Beveling|
|High-end Equipment:||FUJI NXT3/XPF Laminator||Material:||FR4/M4/M6/Rogers/TU872/IT968|
|Test:||AOI/ X-Ray/Flying-Probe/Function Test||Other Service:||Components Purchase /Assembly/Custom Packaging|
V CUT IT968 PCB Assembly Service,
custom pcb assembly HASL lead free,
V CUT custom pcb assembly
OEM And ODM Electronic Control Board PCB Assembly Service Customized Logo
Advantages of CESGATE
1. As a one-stop service shop, satisfied services will start from your inquiry to after-sales.
2. Free design stack-up service, modify until you are satisfied.
3. Each process is monitored by specialized quality inspection personnel to detect problems in time and solve them as soon as possible.
4. Expedited service is supported.
5. More than ten years of PCB Assembly Service experience.
Our company currently has 7 wave soldering production lines and 10 post-DIP soldering lines. We can make special fixtures according to customer requirements and product conditions to ensure product reliability and effectively improve plug-in efficiency.
Our DIP post-welding personnel have rich experience for PCB assembly service, and have formulated detailed standardized operation guidelines and SOP operation instructions to meet the high-quality requirements of high-end customers.
|2||Maximum machining size||600mm*1200mm|
|6||Minimum finished aperture||0. 10mm|
|7||Maximum thickness to diameter ratio||15:1|
|8||Via treatment||Via, blind&buried via, via in pad, Copper in via …|
|9||Surface finish/treatment||HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating|
|10||Base Material||FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
|11||Solder mask color||Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black|
|12||Testing Service||AOI, X-Ray, Flying-Probe, Function Test, First Article Tester|
|16||Min mechanical aperture||0.1mm|
|17||Min laser aperture||0.075mm|
CESGATE has the capability to manufacture pcb ranging from basic single sided boards up to forty layers, and provide one stop turnkey services, including PCB manufacture, PCB assembly service, components sourcing and function testing. With one-stop solution, high-end product structure, professional product development and manufacturing technology, stable quality performance and well management system.
CESGATE has established long-term and stable cooperate relations with the world's leading communication equipment, aerospace electronics and medical equipment manufacturers.
|Q: What is your delivery date?
CESGATE: The general sample delivery time is 6 working days for single and double-sided boards, 7 working days for 4-layer boards, and an additional working day for every 2 layers. However, if there are special processes, additional working days will be added according to the situation.
Generally, the delivery time for mass production is 10 working days for single and double-sided panels, and 15 working days for multi-layer panels. However, if there is a special process or more than a certain number of working days, the working days will be additionally increased according to the situation; you can also pay the urgent fee to shorten the number of days, please contact Contact the business specially proposed, depending on the individual situation to provide expedited days.
|Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
|Q: What are the types of solder mask?
CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type.
Q: What are the common substrates of CESGATE?
Tg-140: ISOLA FR402 / NAN-YA NP-140