| Place of Origin: | China |
|---|---|
| Brand Name: | CESGATE |
| Certification: | UL、IATF16949、ISO9001 |
| Model Number: | NA |
| Minimum Order Quantity: | 1PCS( NO MOQ) |
| Price: | Negotiable (Depends on your GERBER and BOM) |
| Packaging Details: | PCB: Vacuum Packing / PCBA: ESD Packing |
| Delivery Time: | 3-7 working days |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 13kk solding spot/day |
| Product Name: | Professional One Stop Services OEM PCBA Prototype Turnkey PCB Assembly Box Build | Feature: | One Stop Services |
|---|---|---|---|
| SMT Production Line: | 14 | High-end Equipment: | FUJI NXT3/XPF Laminator |
| Material: | FR4/M4/M6/Rogers/TU872/IT968 | Item: | Keyboard Pcb Assembly, PCBA For Electronic Project, Cheap Turnkey Prototype Pcb Circuit Board Assembly Provider, Custom Circuit Board, 2 Layer Pcb |
| Test: | AOI/SPI/XRAY/First Article Inspection | QTY: | High Volume PCBA Board |
| High Light: | FR4 M4 M6 Turnkey PCB Assembly,PCBA Prototype Box Build,FR4 M4 M6 PCBA Prototype |
||
Professional One Stop Services OEM PCBA Prototype Turnkey PCB Assembly Box Build
CESGATE's advantages of turnkey PCB assembly
CESGATE is not only a leading PCB manufacturer, but also can meet your assembly and component sourcing needs. We will purchase the components in the BOM while producing the PCB, and start the assembly at the fastest speed. CESGATE is equipped with multiple high-end equipments, such as: FUJI XPF, NXT3, AIMEX, AOI/SPI/XRAY/First article tester etc., min. mount: 03015, 01005, 0201, 0402
In the PCB industry for more than ten years, a standardized and rigorous process and system has been established to effectively reduce quality problems
What CESGATE provide?
1. Turnkey service from PCB fabrication, assembly, BOM procurement to delivery.
2. Long-time warranty
3. Expedited service is supported.
4. Strict and standardized IQC incoming inspection
Technical Requirement for turnkey pcb assembly
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206, 0805, 0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) Turnkey PCB Assembly With CE, FCC, Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Specification
| Article | Description | Capability |
| Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
| Board Cutting | Number of layers | 1-48 |
| Min.thickness for inner layers (Cu thickness are excluded) |
0.003”(0.07mm) | |
| Board Thickness | Standard | (0.1-4mm±10%) |
| Min. | Single/Double:0.008±0.004” | |
| 4layer:0.01±0.008” | ||
| 8layer:0.01±0.008” | ||
| Bow and twist | no more than 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z | |
| Drilling | Min size | 0.0078”(0.2mm) |
| Drill deviation | ±0.002″(0.05mm) | |
| PTH hole tolerance | ±0.002″(0.005mm) | |
| NPTH hole tolerance | ±0.002″(0.005mm) | |
| Solder Mask | Color | Green,white,black,red,blue… |
| Min solder mask clearanace | 0.003″(0.07mm) | |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | white,black,yellow,blue… |
| Min size | 0.006″(0.15mm) | |
| Max Size of Finish Board | 700*460mm | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
| PCB Outline | Square,circle,irregular(with jigs) | |
| Package | QFN,BGA,SSOP,PLCC,LGA | |
FAQ
| Q: The Wire Bonding process is required when the circuit board is printed. What should I pay attention to when making the circuit board? CESGATE: When making circuit boards, the surface treatment options are mostly "nickel palladium gold ENEPIG" or "chemical gold ENIG". If the Al aluminum wire is used, the gold thickness is recommended to be 3μ”～5μ”, but if the Au gold wire is used, the gold thickness should preferably be more than 5μ”. |
| Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board? CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material. |
| Q: Can your company provide the serial number when making circuit board text? CESGATE: Serial numbers can be provided, and in addition to text serial numbers, QR-CODE can also be provided for customers to query. |
| Q: How long is the shelf life of the PCB board and how should it be stored? CESGATE: 25℃ / 60%RH is recommended when the PCB is stored. The plate itself has no shelf life, but if it exceeds three months, it needs to be baked to remove moisture and stress, and it should be used immediately after baking. It is recommended that the pieces should be loaded within 6 months of storage to reduce the phenomenon of rejection and explosion. |
