Altium Designer 20 Turnkey PCB Assembly Engineering Bill Of Materials Template

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL、IATF16949、ISO9001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 3-7 working days
Payment Terms: T/T, L/C
Supply Ability: 13kk solding spot/day
Product Name: Altium Designer 20 Turnkey PCB Assembly Engineering Bill Of Materials Template Feature: Altium Designer 20
High-end Equipment: FUJI NXT3/XPF Laminator Material: FR4/M4/M6/Rogers/TU872/IT968
Lead Time: 3-7 Working Days Testing Service: AOI X-Ray Function Test
Warranty: 3 Months MOQ: No MOQ
High Light:

Altium Designer 20 Turnkey PCB Assembly

,

High TG FR4 Turnkey PCB Assembly

Altium Designer 20 Turnkey PCB Assembly Engineering Bill Of Materials Template

 

 

PCB Process - Introduction to HDI
HDI (High Density Interconnect): High-density interconnection technology, mainly using micro-blind / buried vias (blind / buried vias), a technology that makes PCB circuit board circuit distribution density higher. The advantage is that it can greatly increase the usable area of ​​the Turnkey PCB Assembly, making the product as miniaturized as possible. However, due to the increase in line distribution density, it is impossible to use traditional drilling methods to drill through holes, and some of the via holes must be drilled with laser drilling to form blind holes, or cooperate with inner-layer buried vias to interconnect.

Generally, the diameter of the laser drilling hole is designed to be 3 ~ 4 mil (about 0.076 ~ 0.1 mm), and the insulation thickness between each laser drilling layer is about 3 mil. Due to the use of laser drilling many times, the key to the quality of the Turnkey PCB Assembly is the hole pattern after laser drilling and whether the hole can be evenly filled after the subsequent electroplating and filling.

 

Specification

 

Article Description Capability
Material Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC...
Board Cutting Number of layers 1-48
Min.thickness for inner layers
(Cu thickness are excluded)
0.003”(0.07mm)
Board Thickness Standard (0.1-4mm±10%)
Min. Single/Double:0.008±0.004”
4layer:0.01±0.008”
8layer:0.01±0.008”
Bow and twist no more than 7/1000
Copper Weight Outer Cu weight 0.5-4 0z
Inner Cu weight 0.5-3 0z
Drilling Min size 0.0078”(0.2mm)
Drill deviation ±0.002″(0.05mm)
PTH hole tolerance ±0.002″(0.005mm)
NPTH hole tolerance ±0.002″(0.005mm)
Solder Mask Color Green,white,black,red,blue…
Min solder mask clearanace 0.003″(0.07mm)
Thickness (0.012*0.017mm)
Silkscreen Color white,black,yellow,blue…
Min size 0.006″(0.15mm)
Max Size of Finish Board 700*460mm
Surface Finish HASL,ENIG,immersion silver,immersion tin,OSP…
PCB Outline Square,circle,irregular(with jigs)
Package QFN,BGA,SSOP,PLCC,LGA

 

 

Brief overview

 

Small to medium volume PCB manufacturer
Multi PCB types manufacturer
EMS/PCBA/OEM customers reliable PCB partner and Turnkey PCB Assembly
Trustworthy supplier for PCB trading companies
Powerful Factory, Quality First .
10 years PCB Manufacturer Experience .
Advanced Automation Production Facilities.
ISO9001, ISO14001 And UL Certified.

 

 

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FAQ

 

 

Q: Can we inspect quality during production?
CESGATE: Yes, we are open and transparent on each production process with nothing to hide. We welcome customer inspect our production process and check in house.
Q: What does CESGATE need for a customized PCBA order?
CESGATE: When you place a PCBA order, you need to provide Gerber or pcb file and the BOM list to us.
Q: What does CESGATE need for a customized PCB order?
CESGATE: When you place a PCB order, the customers need to provide Gerber or pcb file. If you do not have the file in the correct format, you can send all the details related to the products.
Q: Which express companies do you cooperate with?
CESGATE: We cooperate with express companies, including DHL, FedEX, UPS, TNT and EMS. And we also have our own freight forwarders, with lower shipping fees.
Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.

Contact Details
Maggie

Phone Number : +8613679040050

WhatsApp : +8618349393344