| Place of Origin: | China |
|---|---|
| Brand Name: | CESGATE |
| Certification: | UL、IATF16949、ISO9001 |
| Model Number: | NA |
| Minimum Order Quantity: | 1PCS( NO MOQ) |
| Price: | Negotiable (Depends on your GERBER and BOM) |
| Packaging Details: | PCB: Vacuum Packing / PCBA: ESD Packing |
| Delivery Time: | 3-7 working days |
| Payment Terms: | T/T, L/C |
| Supply Ability: | 13kk solding spot/day |
| Product Name: | SMT DIP Soldering ROHS HASL ENIG Lead Free Turnkey PCB Assembly Fabrication | Feature: | SMT DIP Soldering |
|---|---|---|---|
| SMT Production Line: | 14 | High-end Equipment: | FUJI NXT3/XPF Laminator |
| Material: | FR4/M4/M6/Rogers/TU872/IT968 | Item: | Keyboard Pcb Assembly, PCBA For Electronic Project, Cheap Turnkey Prototype Pcb Circuit Board Assembly Provider, Custom Circuit Board, 2 Layer Pcb |
| Test: | AOI/SPI/XRAY/First Article Inspection | QTY: | Support Prototype And Batch Production |
| High Light: | Soldering Turnkey PCB Assembly,Soldering pcb fabrication and assembly,pcb fabrication and assembly 0.003'' |
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SMT DIP Soldering ROHS HASL ENIG Lead Free Turnkey PCB Assembly Fabrication
Technical Requirement for turnkey pcb assembly
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206, 0805, 0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) Turnkey PCB Assembly With CE, FCC, Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
What CESGATE provide?
1. Reasonable and competitive price
2. Provide component selection service for customers, including alternative component selection service for out of stock components
3. Expedited service is supported for those urgent orders
4. Complete after-sales services
CESGATE's advantages of turnkey PCB assembly
CESGATE is not only a leading PCB manufacturer, but also can meet your assembly and component sourcing needs. We will purchase the components in the BOM while producing the PCB, and start the assembly at the fastest speed. CESGATE is equipped with multiple high-end equipments, such as: FUJI XPF, NXT3, AIMEX, AOI/SPI/XRAY/First article tester etc., min. mount: 03015, 01005, 0201, 0402
In the PCB industry for more than ten years, a standardized and rigorous process and system has been established to effectively reduce quality problems
Specification
| Article | Description | Capability |
| Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
| Board Cutting | Number of layers | 1-48 |
| Min.thickness for inner layers (Cu thickness are excluded) |
0.003”(0.07mm) | |
| Board Thickness | Standard | (0.1-4mm±10%) |
| Min. | Single/Double:0.008±0.004” | |
| 4layer:0.01±0.008” | ||
| 8layer:0.01±0.008” | ||
| Bow and twist | no more than 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z | |
| Drilling | Min size | 0.0078”(0.2mm) |
| Drill deviation | ±0.002″(0.05mm) | |
| PTH hole tolerance | ±0.002″(0.005mm) | |
| NPTH hole tolerance | ±0.002″(0.005mm) | |
| Solder Mask | Color | Green,white,black,red,blue… |
| Min solder mask clearanace | 0.003″(0.07mm) | |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | white,black,yellow,blue… |
| Min size | 0.006″(0.15mm) | |
| Max Size of Finish Board | 700*460mm | |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… | |
| PCB Outline | Square,circle,irregular(with jigs) | |
| Package | QFN,BGA,SSOP,PLCC,LGA | |
FAQ
| Q: What is your delivery date? CESGATE: The general sample delivery time is 6 working days for single and double-sided boards, 7 working days for 4-layer boards, and an additional working day for every 2 layers. However, if there are special processes, additional working days will be added according to the situation. Generally, the delivery time for mass production is 10 working days for single and double-sided panels, and 15 working days for multi-layer panels. However, if there is a special process or more than a certain number of working days, the working days will be additionally increased according to the situation; you can also pay the urgent fee to shorten the number of days, please contact Contact the business specially proposed, depending on the individual situation to provide expedited days. |
| Q: What is the difference between the HDI board and the general circuit board? CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once. |
| Q: What are the types of solder mask? CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type. |
| Q: What are the common substrates of CESGATE? A:Tg-140: ISOLA FR402 / NAN-YA NP-140 Tg-150: ISOLA IS400 / NAN-YA NP-155 Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F |
