Soldering Turnkey PCB Assembly And Fabrication 0.003'' Inner Layers

Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL、IATF16949、ISO9001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 3-7 working days
Payment Terms: T/T, L/C
Supply Ability: 13kk solding spot/day
Product Name: SMT DIP Soldering ROHS HASL ENIG Lead Free Turnkey PCB Assembly Fabrication Feature: SMT DIP Soldering
SMT Production Line: 14 High-end Equipment: FUJI NXT3/XPF Laminator
Material: FR4/M4/M6/Rogers/TU872/IT968 Item: Keyboard Pcb Assembly, PCBA For Electronic Project, Cheap Turnkey Prototype Pcb Circuit Board Assembly Provider, Custom Circuit Board, 2 Layer Pcb
Test: AOI/SPI/XRAY/First Article Inspection QTY: Support Prototype And Batch Production
High Light:

Soldering Turnkey PCB Assembly

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Soldering pcb fabrication and assembly

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pcb fabrication and assembly 0.003''

SMT DIP Soldering ROHS HASL ENIG Lead Free Turnkey PCB Assembly Fabrication​

 

 

Technical Requirement for turnkey pcb assembly

 

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206, 0805, 0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) Turnkey PCB Assembly With CE, FCC, Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

 

 

What CESGATE provide?


1. Reasonable and competitive price
2. Provide component selection service for customers, including alternative component selection service for out of stock components
3. Expedited service is supported for those urgent orders
4. Complete after-sales services

 

 

CESGATE's advantages of turnkey PCB assembly

 

CESGATE is not only a leading PCB manufacturer, but also can meet your assembly and component sourcing needs. We will purchase the components in the BOM while producing the PCB, and start the assembly at the fastest speed. CESGATE is equipped with multiple high-end equipments, such as: FUJI XPF, NXT3, AIMEX, AOI/SPI/XRAY/First article tester etc., min. mount: 03015, 01005, 0201, 0402

 

In the PCB industry for more than ten years, a standardized and rigorous process and system has been established to effectively reduce quality problems

 

 

Specification

 

Article Description Capability
Material Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC...
Board Cutting Number of layers 1-48
Min.thickness for inner layers
(Cu thickness are excluded)
0.003”(0.07mm)
Board Thickness Standard (0.1-4mm±10%)
Min. Single/Double:0.008±0.004”
4layer:0.01±0.008”
8layer:0.01±0.008”
Bow and twist no more than 7/1000
Copper Weight Outer Cu weight 0.5-4 0z
Inner Cu weight 0.5-3 0z
Drilling Min size 0.0078”(0.2mm)
Drill deviation ±0.002″(0.05mm)
PTH hole tolerance ±0.002″(0.005mm)
NPTH hole tolerance ±0.002″(0.005mm)
Solder Mask Color Green,white,black,red,blue…
Min solder mask clearanace 0.003″(0.07mm)
Thickness (0.012*0.017mm)
Silkscreen Color white,black,yellow,blue…
Min size 0.006″(0.15mm)
Max Size of Finish Board 700*460mm
Surface Finish HASL,ENIG,immersion silver,immersion tin,OSP…
PCB Outline Square,circle,irregular(with jigs)
Package QFN,BGA,SSOP,PLCC,LGA

 

 

 

 

Soldering Turnkey PCB Assembly And Fabrication 0.003'' Inner Layers 0Soldering Turnkey PCB Assembly And Fabrication 0.003'' Inner Layers 1Soldering Turnkey PCB Assembly And Fabrication 0.003'' Inner Layers 2Soldering Turnkey PCB Assembly And Fabrication 0.003'' Inner Layers 3

 

 

FAQ

 

 

Q: What is your delivery date?
CESGATE: The general sample delivery time is 6 working days for single and double-sided boards, 7 working days for 4-layer boards, and an additional working day for every 2 layers. However, if there are special processes, additional working days will be added according to the situation.
Generally, the delivery time for mass production is 10 working days for single and double-sided panels, and 15 working days for multi-layer panels. However, if there is a special process or more than a certain number of working days, the working days will be additionally increased according to the situation; you can also pay the urgent fee to shorten the number of days, please contact Contact the business specially proposed, depending on the individual situation to provide expedited days.
Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
Q: What are the types of solder mask?
CESGATE: There are traditional epoxy resin IR baking type, UV curing type, Liquid Photo Imageable Solder Mask and Dry film solder mask. Currently, the liquid solder mask is the main type.
Q: What are the common substrates of CESGATE?
A:Tg-140: ISOLA FR402 / NAN-YA NP-140
Tg-150: ISOLA IS400 / NAN-YA NP-155
Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F

Contact Details
Kevin

WhatsApp : +8618349393344