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Home ProductsPCB Assembly ServiceMixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm

Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm

Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm
Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm
Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm
Basic Information
Place of Origin: China
Brand Name: CESGATE
Certification: UL, IATF16949, ISO9001
Model Number: NA
Minimum Order Quantity: 1PCS( NO MOQ)
Price: Negotiable (Depends on your GERBER and BOM)
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 3-7 working days
Payment Terms: T/T, L/C
Supply Ability: 13kk soldering spot/day
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Product Name: IPC 3 PCB Assembly Service Feature: Lead Free
Min Package: 03015 SMT Production Line: 14
High-end Equipment: FUJI NXT3/XPF Laminator Material: FR4/M4/M6/Rogers/TU872/IT968
Test: AOI/SPI/XRAY/First Article Inspection Warranty: 3 Months
High Light:

Mixed dielectric Multilayer PCB IPC 3 1.6mm

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Mixed dielectric Multilayer PCB Assembly IPC 3 1.6mm

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Multilayer PCB Assembly 1.6mm

 

Mixed-dielectric multialyer Lead Free IPC 3 OEM PCB Assembly Service 1.6mm

 

 

Production Equipments

CESGATE is equipped with central air conditioning, constant temperature and humidity warehouse, air shower room, anti-static treatment, etc. Equipped with new imported Fuji XPF, NXT3, automatic solder paste printing machine, ten temperature zone reflux furnace, wave soldering, AOI/SPI/XRAY/First Article Inspection. CESGATE works well in high-precision, high-complexity PCB Assembly Service, and acts in producing ultra-complex PCB Assembly Service.

 


SMT Assembly Quality Control

  • AOI: Detect various problems after placement: short circuit, material leakage, polarity, displacement, wrong parts
  • Xray: Open circuit and short circuit detection of BGA, QFN and other devices
  • Adhesive cardboard: Test whether the SMT placement position is correct, greatly reduce the SMT trial production time and the waste of components, and effectively ensure the quality of SMT
  • Intelligent first-piece detector: detects wrong materials, missing parts, polarity, orientation, silk screen, etc., mainly used in the detection of first-piece; compared with manual detection, the accuracy is higher and the speed is increased by 50%+
  • SPI-Automatic 3D Solder Paste Thickness Gauge: Detects various solder paste printing quality problems such as missing printing, less tin, more tin, continuous tin, offset, poor shape, board surface pollution, etc.

 

Company Descripiton:
 
CESGATE focuses on one-stop service like research and development of sample making, batch PCB Assembly Service, test:

  1. SMT production line: 14 SMT production lines.
  2. High-end equipments: FUJI XPF, NXT3, AIMEX, AOI/SPI/XRAY/ First article inspection, etc.
  3. Full BOM material selection: more than 60,000 kinds of common electronic components are in stock.
  4. Fast delivery: 8 hours of expedited delivery, with an accurate delivery rate of more than 95% within 48 hours.
  5. Minimum mount: 03015,01005,0201,0402.
  6. One-stop hardware innovation platform: PCB fabrication, assembly, component selection.

 
Production equipments:
 
CESGATE is equipped with central air conditioning, air shower room, anti-static treatment, constant temperature and humidity warehouse, etc. Equipped with new imported Fuji XPF, NXT3, automatic solder paste printing machine, ten temperature zone reflux furnace, wave soldering, AOI/SPI/XRAY/First Article Inspection.
 
CESGATE is especially good at high-precision, high-complexity PCB Assembly Service, and has actual performance in producing ultra-complex PCBAs.
 
SMT assembly quality control:
 

  1. Adhesive cardboard: Test whether the SMT placement position is correct, greatly reduce the SMT trial production time and the waste of components, and effectively ensure the quality of SMT
  2. Intelligent first-piece detector: detects wrong materials, missing parts, polarity, orientation, silk screen, etc., mainly used in the detection of first-piece; compared with manual detection, the accuracy is higher and the speed is increased by 50%+
  3. SPI-Automatic 3D Solder Paste Thickness Gauge: Detects various solder paste printing quality problems such as missing printing, less tin, more tin, continuous tin, offset, poor shape, board surface pollution, etc.
  4. AOI: Detect various problems after placement: short circuit, material leakage, polarity, displacement, wrong parts
  5. Xray: Open circuit and short circuit detection of BGA, QFN and other devices.

 
Specification :

 

NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm

 


Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm 0Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm 1Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm 2Mixed Dielectric Multilayer Prototype PCB Assembly Lead Free IPC 3 1.6mm 3


 

 

FRQ

 

Q: What is your inspection policy? How do you control the quality?
CESGATE: In order to ensure the quality of PCB products, flying probe inspection is usually used; electrical fixtures, automatic optical inspection (AOI), BGA parts x-ray inspection, first article inspection ( FAI) etc.
Q: What service do you have?
CESGATE: We provide turnkey solution including RD, PCB fabrication, SMT, final assembly,testing and other value-added service.
Q: What are the main products of your PCB/PCBA services?
CESGATE: Our PCB/PCBA services are mainly for the industries including Medical, Automotive, Energy, Metering/Measurements, Consumer Electronics.
Q: Is CESGATE a factory or trade company?
CESGATE: CESGATE is a factory with PCB factory located in Senzhen and SMT assembly factories in both Shenzhen and Chengdu.
Q: Can we inspect quality during production?
CESGATE: Yes, we are open and transparent on each production process with nothing to hide. We welcome customer inspect our production process and check in house.
Q: How can we ensure our information should not let third party to see our design?
CESGATE: We are willing to sign NDA effect by customer side local law and promising to keep customers data in high confidential level.

Tag:

SMT multilayer printed circuit board

pcb board prototype 1206 0805 0603

2.0mil pcb board prototype

Contact Details
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Phone Number : +8618349393344

WhatsApp : +8618349393344

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