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Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test

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FR4 Printed Circuit Board

FR4 Printed Circuit Board Sample Introduction

Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test

China Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test Supplier
Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test Supplier Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test Supplier

Large Image :  Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: Negotiation
Model Number: 18 layersPCB​,SMT PCB Assembly With FR4 Material Thickness 1.6mm Green Solder Mask Copper 1OZ AOI X-Ray Function Test CE Rohs Standard

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 20-25 working days
Payment Terms: T/T, Western Union
Supply Ability: 5-200K/pcs per month
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Detailed Product Description
Base Material: TACONIC Min. Line Spacing: 1/2 Oz. Copper .003" +/- .0005" (0.0762mm)
Surface Finishing: ENIG Application: Electronic Products
Product Name: PCB Board Manufacturer PCB Assembly PCB Design Testing Service: 100% Electrical Test,Omron AOI/X-Ray/ICT/Solder Paste Testing/Function Testing
Solder Mask Color: Green/white/yellow/black/blue/purple Service: PCB&PCBA Design&Clone&Production
High Light:

pcb printed circuit board

,

fr4 copper clad circuit board

18 layersPCB​,SMTPCB Assembly FR-4+TG180, thickness 3.50mm,Green Solder Mask Copper 1OZ AOI X-Ray Function Test CE

 

Product Description

  1. Product area: industrial products
  2. Product structure: 18 layersPCB, FR-4+TG180, component purchase,
    SMT+PID high frequency mixing, laser hole 0.10mm, copper hole filling,
  3. inner and outer copper thickness 35um, hole copper 20um, impedance ±10%, thickness 3.50mm, Immersion Gold 2u", size 850*420mm

     

  4. Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Technical requirement

  1. Professional surface-mounting and through-hole soldering technology
  2. Various sizes are available, like 1206, 0805, 0603 components SMT technology
  3. ICT (in circuit test), FCT (functional circuit test) technology
  4. PCB assembly with UL, CE, FCC and RoHS approvals
  5. Nitrogen gas reflow soldering technology for SMT
  6. High standard SMT and solder assembly line
  7. High density interconnected board placement technology capacity

Advantages:
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities

 

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2~45L 2~60L 2~80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1~36L 1~50L 1~60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2~12L 2~18L 2~26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3~26L 3~30L 3~50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4~45L 4~60L 4~80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1~40u" 1~60u" 1~120u"
Nithick 76~127u" 76~200u" 1~250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

 

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
 

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
 

PCB Assembly services:
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
 

Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material

 

Detailed Specification of PCB Manufacturing

1 layer 1-30 layer
2 Material CEM-1, CEM-3 FR-4, FR-4 High TG,
Polyimide,
Aluminum-based
material.
3 Board thickness 0.2mm-6mm
4 Max.finished board size 800*508mm
5 Min.drilled hole size 0.25mm
6 min.line width 0.075mm(3mil)
7 min.line spacing 0.075mm(3mil)
8 Surface finish HAL, HAL Lead free,Immersion Gold/
Silver/Tin,
Hard Gold, OSP
9 Copper thickness 0.5-4.0oz
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing,Plastic bag
12 Outer packing standard carton packing
13 Hole tolerance PTH:±0.076,NTPH:±0.05
14 Certificate UL,ISO9001,ISO14001,ROHS,TS16949
15 Profiling punching Routing,V-CUT,Beveling

 

Testing Methods
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
 

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
 

Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

 

Design file format:
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)

 

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

 

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

  1. Thickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function TestThickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function TestThickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function TestThickness 3.50mm SMT PCB Assembly Green Solder Mask Copper 1OZ AOI X-Ray Function Test

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

Send your inquiry directly to us (0 / 3000)

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