Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Special circuit board making technology
Special circuit board making technology

Special circuit board making technology

Rigid plate process capability:

Number of layers: 1-36

Minimum line width / spacing: 1.2mil

Maximum plate thickness to aperture ratio: 12:1

Minimum mechanical bore diameter: 4mil, laser hole 4mil

Surface treatment: spray tin lead, electroless gold, palladium, electroless nickel immersion tin, immersion silver, full board gold-plated, organic coating processing, lead-free spray tin, gold plated, gold plated soft, golden finger

Board thickness: 0.10mm~10.0mm

Materials: FR-4, TG, halogen, high BT, iron, copper, aluminum, high frequency (Rogers, ArlonTaconic, Nelco, DuPont, Panasonic, dragon, Taixing Tiefo microwave F4B, Isola... Etc.)

Maximum board size: 22.5 * 42.5

Soft and hard board; process capability

Large scale production capacity of high density rigid flex products

Maximum number of layers: 36

Minimum line spacing: 1.5/1.5mil

Thickness to aperture ratio: 12:1

Minimum mechanical bore diameter: 4mil

Surface treatment process: lead, tin, chemical precipitation, tin, silver, organic coating, lead-free tin, hard gold, soft gold, silver paste and so on

Impedance control technique

HDI Technology

Process capability of metal substrate

Number of layers: 1-16L (metal substrate & metal core board), 2-26L (embedded / embedded metal plate & cold plate & sintered plate), 1-10L (ceramic DBC plate)

Board thickness: 0.5-8.0mm size: max:1100*650, min:5*5mm

Machining: X/Y/Z accuracy + 0.03mm, horn hole, screw hole

Thermal conductivity of thermal conductive material: conventional heat conduction material: 1-4W/m.k; ceramic heat conduction material: 24-240W/m

Metal surface treatment: aluminum oxide, aluminum oxide, ordinary hard aluminum chemical passivation, sandblasting, wire drawing, surface plating

Surface treatment: hot air leveling, electroless gold, palladium, electroless nickel immersion tin, silver, gold, heavy full plate electroplating hard / soft gold, organic coating processing etc.

Type: Pre-bonding, Postbonding, sintering process, metal sandwich, embedded metal block, cold plate, ceramic DBC board

 

Pub Time : 2012-06-28 12:40:32 >> News list
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Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mr. Mank.Li

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