In many applications, weight and physical size are very important. If the actual power consumption of the component is small, the safety factor of the design may be too high, so that the design of the board is based on the actual or inconsistent component power consumption value. Perform a thermal analysis.
In general, the distribution of copper foil on the PCB board is very complicated and difficult to accurately model. Therefore, the shape of the wiring needs to be simplified during modeling, and the electronic components on the ANSYS model circuit board that are close to the actual circuit board can be simulated by simplified modeling, such as MOS tubes and integrated circuit blocks.
Thermal analysis in placement processing assists the designer in determining the electrical performance of the components on the PCB board and helps the designer determine if the component or board will burn out due to high temperatures. A simple thermal analysis simply calculates the average temperature of the board, and a complex one creates a transient model of an electronic device with multiple boards. The accuracy of the thermal analysis ultimately depends on the accuracy of the component's power consumption provided by the board designer.
In many applications, weight and physical size are very important. If the actual power consumption of the component is small, the safety factor of the design may be too high, so that the design of the board is based on the actual or inconsistent component power consumption value. Perform a thermal analysis. The opposite (and more serious) is that the thermal safety factor is designed too low, that is, the actual operating temperature of the component is higher than that predicted by the analyst. Such problems are generally solved by adding a heat sink or a fan to the board. Cool down to solve. These external accessories add cost and extend manufacturing time. Adding a fan to the design can also cause instability in reliability. Therefore, the circuit board mainly uses active rather than passive cooling (such as natural convection, conduction and radiation). Cooling).
Simplified modeling of circuit boards
Before modeling, analyze the main heating devices in the circuit board, such as MOS tubes and integrated circuit blocks. These components convert most of the power loss into heat during operation. Therefore, these devices need to be considered primarily in modeling.
In addition, copper foil coated as a wire on the board substrate is also considered. They not only play the role of electricity in the design, but also play the role of conducting heat. The thermal conductivity and heat transfer area are relatively large. The circuit board is an indispensable component of the electronic circuit. Its structure is composed of epoxy substrate. And consists of a copper foil coated as a wire. The thickness of the epoxy resin substrate was 4 mm, and the thickness of the copper foil was 0.1 mm. The thermal conductivity of copper is 400 W/(m ° C), while the thermal conductivity of epoxy resin is only 0.276 W/(m ° C). Although the added copper foil is very thin and thin, it has a strong guiding effect on heat, so it cannot be ignored in modeling.
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