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HDI blind hole multi - layer production technology

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HDI blind hole multi - layer production technology
HDI blind hole multi - layer production technology

With the development of high-density and high-precision electronic products, the same requirements are imposed on circuit boards. The most effective way to increase the density of pcb is to reduce the number of through holes, and to accurately set blind holes and buried holes.
1. Blind hole definition a: In contrast to the through hole, the through hole refers to the hole through which each layer is drilled, and the blind hole is the non-drilled through hole. (Illustration, eight-layer board example: through hole, blind hole, buried hole) b: blind hole subdivision: blind hole (BLIND HOLE), buried hole BURIED HOLE (outer layer is not visible); c: from the production process Distinction: The blind hole is drilled before pressing, and the through hole is drilled after pressing.
2: HDI market distribution demand
3: HDI multilayer board structure
HDI Manufacturing Process Flow
4: HDI high density board
The printed circuit board is a structural element formed by an insulating material supplemented by conductor wiring. In the final product, integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors, etc.) and various other electronic components are installed. By connecting wires, electronic signal connections and organic energy can be formed. Therefore, a printed circuit board is a platform that provides component bonding for receiving the base of the component.
The printed circuit board is a structural element formed by an insulating material supplemented by conductor wiring. In the final product, integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors, etc.) and various other electronic components are installed. By connecting wires, electronic signal connections and organic energy can be formed. Therefore, a printed circuit board is a platform that provides component bonding for receiving the base of the component.
Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.
Under the premise that electronic products tend to be more complex, the contact distance of integrated circuit components is reduced, and the speed of signal transmission is relatively increased, which is followed by an increase in the number of wires and the length of the wires between the points. Localized shortening requires high-density line configuration and micro-hole technology to achieve the goal. Wiring and bridging basically have difficulties for single and double panels, so the circuit board will be multi-layered, and as the signal lines continue to increase, more power layers and ground planes are necessary means of design. These all make the Multilayer Printed Circuit Board more common.
For the electrical requirements of high-speed signals, the board must provide impedance control with AC characteristics, high-frequency transmission capability, and reduce unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality of the signal transmission, an insulating material with a low dielectric constant and a low attenuation rate is used. In order to meet the miniaturization and array of the electronic component assembly, the circuit board also continuously increases the density to meet the demand. The emergence of assembly methods such as BGA (Ball Grid Array), CSP (Chip Scale Package), and DCA (Direct Chip Attachment) has pushed printed circuit boards to an unprecedented high-density realm.

Pub Time : 2009-06-01 12:23:28 >> News list
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