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Ceramic circuit board technology
Ceramic circuit board technology

Ceramic circuit board technology
Ceramic circuit board
A ceramic circuit board refers to a circuit board having a ceramic substrate. The ceramic substrate refers to a special process plate in which a copper foil is directly bonded to a surface of an alumina (Al 2 O 3 ) or aluminum nitride (AlN) ceramic substrate (single or double sided) at a high temperature. The ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current carrying current. ability. Therefore, ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology.
Comparison of plastic and ceramic materials
So far, plastics, especially epoxy resins, have dominated the entire electronics market due to their relatively good economics, but many special fields such as high temperature, coefficient of linear expansion, mismatch, air tightness, stability, and mechanical properties are obviously not suitable. Even if a large amount of organic bromide is added to the epoxy resin, it does not help.
Compared with plastic materials, ceramic materials play an important role in the electronics industry. They have high electrical resistance, high frequency characteristics, high thermal conductivity, good chemical stability, high thermal stability and high melting point. These properties are highly desirable in the design and manufacture of electronic circuits, so ceramics are widely used for substrate materials of different thick films, films and circuits, and can also be used as insulators for conducting thermal paths in thermally demanding circuits and for Manufacturing various electronic components.
Ceramic substrate manufacturing
It is very difficult to manufacture high-purity ceramic substrates. Most ceramics have high melting point and hardness, which limits the possibility of ceramic machining. Therefore, ceramic substrates are often doped with lower melting point glass for fluxing or bonding. The final product is easy to machine. Al2O3, BeO, AlN substrate preparation process is very similar, the base material is ground to a powder diameter of about several microns, mixed with different glass flux and adhesive (including powdered MgO, CaO), in addition to the mixture Some organic binders and different plasticizers are ball milled to prevent agglomeration to make the ingredients uniform, to shape the green sheets, and finally to high temperature sintering.
At present, there are several methods for ceramic molding:
Roller Rolling: The slurry is sprayed onto a flat surface, partially dried to form a sheet of viscous like putty, which is then fed into a pair of large parallel rolls to obtain a uniform thickness of green slab.
· Casting: The slurry is applied to a moving belt to form a sheet by a sharp blade. This is a low pressure process compared to other processes.
· Powder pressing: The powder is sintered in a hard mold cavity and subjected to a large pressure (about 138 MPa). Although the pressure unevenness may cause excessive warpage, the sintered part produced by this process is very dense and has a small tolerance.
• Isostatic powder compaction: This process uses a mold that is surrounded by water or glycerin and uses a pressure of up to 69 MPa to produce a more uniform warpage of the part.
· Extrusion: Slurry extrusion through the die This process uses a lower viscosity and it is difficult to obtain a smaller tolerance, but this process is very economical and can result in thinner parts than other methods.
The relationship between circuit boards, ceramic substrates and LTCC
LTCC means low-temperature co-fired ceramics. Since the maximum sintering temperature of silver is 920 ° C, in order to be able to fabricate silver wires on ceramics, low-temperature co-firing is performed. If a silver wire is printed on the inside and the surface of the ceramic and is cooked together with the ceramic, it is a so-called ceramic substrate. The ceramic plate on which the heat dissipation and the two layers of the LED lamp are used for the upper and lower sides of the LED lamp is a ceramic substrate, and of course, there is also a firing. For substrates, circuit boards are currently mostly composed of organic materials. Nowadays, in order to achieve greater integration, we hope to integrate many capacitor resistors and inductors into the PCB board. Most of these are ceramic materials. High-temperature sintering is required. PCBs cannot be burned. Everyone thinks of ceramics with good insulation properties and high temperature sintering. Plate, ceramic dielectric constant, etc. are adjustable

Lidao Seiko is one of the few companies that can produce ceramic substrate printed film circuits. It can achieve fast production in 48 hours. Adapt to the research and development needs of scientific research and teaching institutions; reduce the research and development cycle of new products of enterprises, and seize the opportunities of the market; can design for customers and produce quickly, and help solve customer design and development problems.
ü Fast: Rapid processing of ceramic-based circuit boards;
ü Flexible: the metal and thickness of the circuit are unlimited;
ü Shaped: ceramic shape and opening without restrictions;
ü Convenient: metal layer pre-processed eutectic pads.
main products:
Ceramic substrate PCB model and small batch of fast plate - inorganic ceramic material alumina, aluminum nitride or tantalum oxide as insulating layer, copper, silver and gold as conductive materials, processing and preparation of single or multiple layers for electronic component packaging circuit board.
ü AlN single/double-sided copper
ü AlN thin film circuit
ü Al2O3 single / double-sided copper
ü Al2O3 thin film circuit
Main substrate:
ü Alumina ceramics
— Alternative to direct bond copper (DBC) process
— Al2O3 substrate with high reliability and high thermal conductivity
— Excellent mechanical strength, tensile strength > 5N/mm2
- Low processing cost, suitable for civil promotion
ü Aluminum nitride ceramics
— Alternative to direct bond copper (DBC) process
— AlN substrate has high reliability and ultra high thermal conductivity (λ > 150 W/m·K)
— Excellent mechanical strength, tensile strength > 5N/mm2
— High thermal conductivity to meet the heat dissipation needs of high-power devices
Process characteristics:
— Using ultra-fine line circuit patterns on ceramic substrates by magnetron sputtering, pattern lithography, dry wet etching, and electroplating thickening.
Ceramic surface metallization:
— Law: Magnetron sputtering.
Connection layer between ceramic and circuit:
— TaN/TiW/Ni/Au (conductive layer, 4um thickness)
Advantages and disadvantages:
• Advantage:
• Thin lines (minimum line width 15um);
• High precision (line width seam error 2um);
• High reliability.
• Disadvantages:
• high cost;
• High purity requirements for ceramics;
• Low resistance, high power is difficult.
Application areas:
• (1) Microstrip circuit devices: couplers, splitters, filters, circulators;
• (2) ceramic thermal layer, support sheet, short circuit;
• (3) Discrete devices: spiral inductors, small capacitance MIM capacitors;
• (4) High-definition microelectronic circuits.

Pub Time : 2013-06-28 12:47:17 >> News list
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