Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Through Hole PCB Assembly Services FR4 Material IC Pre Programming / Burning

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PCB Assembly Services

PCB Assembly Services Sample Introduction

Through Hole PCB Assembly Services FR4 Material IC Pre Programming / Burning

China Through Hole PCB Assembly Services FR4 Material IC Pre Programming / Burning Supplier
Through Hole PCB Assembly Services FR4 Material IC Pre Programming / Burning Supplier Through Hole PCB Assembly Services FR4 Material IC Pre Programming / Burning Supplier Through Hole PCB Assembly Services FR4 Material IC Pre Programming / Burning Supplier Through Hole PCB Assembly Services FR4 Material IC Pre Programming / Burning Supplier

Large Image :  Through Hole PCB Assembly Services FR4 Material IC Pre Programming / Burning

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: cspcba1028

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: usd36.80/pcs
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 15-20 working days
Payment Terms: T/T, Western Union
Supply Ability: 10,000pcs per month
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Detailed Product Description
Product Areas: Communication System Products Material: FR-4, TG170,14-layer HDI
Board Thickness: 1.60mm Size Mm: 650*280mm
Impedance Value: ± 10% Minimum Hole: 0.10mm
Minimum Line Width And Space: 3/3mil Aspect Ratio: 12:1
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
PCBA Information: BOM Report, X, Y Left Plot Copper Thickness: 1/0.5/0.5/0.5/0.5/1OZ

Through Hole PCB Assembly FR4 Material IC pre-programming / Burning on-line Conformal coating Green Solder Mask Rohs CE 

Huaswin specialized in PCB manufacturing and and PCB Assembly
PCBA capabilities:

FR-4, TG170,14-layer HDI+PCBA

  1. Fast prototyping
  2. High mix, low and medium volume build
  3. SMT MinChip:0201
  4. BGA: 1.0 to 3.0 mm pitch
  5. Through-hole assembly
  6. Special processes (such as conformal coating and potting)
  7. ROHS capability
  8. IPC-A-610E and IPC/EIA-STD workmanship operation

PCB Assembly services:

 

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.


SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

 

Detailed Specification of PCB Manufacturing

 

1 layer 1-80 layer
2 Material CEM-1, CEM-3 FR-4, FR-4 High TG,M6,lsola,3M
Polyimide,
Aluminum-based
material.
3 Board thickness 0.2mm-6mm
4 Max.finished board size 800*508mm
5 Min.drilled hole size 0.25mm
6 min.line width 0.075mm(3mil)
7 min.line spacing 0.075mm(3mil)
8 Surface finish HAL, HAL Lead free,Immersion Gold/
Silver/Tin,
Hard Gold, OSP
9 Copper thickness 0.5-4.0oz
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing,Plastic bag
12 Outer packing standard carton packing
13 Hole tolerance PTH:±0.076,NTPH:±0.05
14 Certificate UL,ISO9001,ISO14001,ROHS,TS16949
15 Profiling punching Routing,V-CUT,Beveling


Through Hole Printed CircuiFR4 Material IC Pre Programming / Burning On Line Conformal Coating Green Solder Mask Rohs CE

Through Hole Printed CircuiFR4 Material IC Pre Programming / Burning On Line Conformal Coating Green Solder Mask Rohs CE

Through Hole Printed CircuiFR4 Material IC Pre Programming / Burning On Line Conformal Coating Green Solder Mask Rohs CE

Through Hole Printed CircuiFR4 Material IC Pre Programming / Burning On Line Conformal Coating Green Solder Mask Rohs CE

Through Hole Printed CircuiFR4 Material IC Pre Programming / Burning On Line Conformal Coating Green Solder Mask Rohs CE

 

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.

Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material

Testing Methods
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949


Design file format:
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)

Advantages:
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

Send your inquiry directly to us (0 / 3000)

PCB Sample

We are good quality supplier of PCB Board Service, PCB Assembly Services, PCB Prototype Service from China.