Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Zhejiang Kunyu Electronic Technology Co., Ltd.
Shenzhen Mingze Electronic Technology Co., Ltd.

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Rigid Flex Printed Circuit Boards Service FR-4 TG150 Gold Finger Minimum Hole 0.35mm

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PCB Prototype Service Sample Introduction

Rigid Flex Printed Circuit Boards Service FR-4 TG150 Gold Finger Minimum Hole 0.35mm

China Rigid Flex Printed Circuit Boards Service FR-4 TG150 Gold Finger Minimum Hole 0.35mm Supplier
Rigid Flex Printed Circuit Boards Service FR-4 TG150 Gold Finger Minimum Hole 0.35mm Supplier Rigid Flex Printed Circuit Boards Service FR-4 TG150 Gold Finger Minimum Hole 0.35mm Supplier

Large Image :  Rigid Flex Printed Circuit Boards Service FR-4 TG150 Gold Finger Minimum Hole 0.35mm

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: cspcb1295

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: USD3.92/PCS
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 15-20day
Payment Terms: T/T, Western Union
Supply Ability: 5-200K/pcs per month
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Detailed Product Description
Product Areas: Intelligent System Products Product Structure: FR-4, TG150
Board Thickness: 1.60mm Impedance Value: ± 10%
Minimum Hole: 0.10mm Minimum Line Width And Space: 3/3mil
Gold Finger: Gold Finger + Electric Thick Gold 30U " Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Provide PCB Information: Gberber, Production Requirements, MOQ Quantity PCBA Information: BOM Report, X, Y Left Plot
Copper Thickness: 35um
High Light:

circuit board printing service

,

custom pcb service

8L2 order HDI plate PCB,FR-4+TG150,  Gold Finger,minimum hole 0.35mm,HDI Printed Circuit Boards,rigid flex pcb manufacturers

Product Description

  1. Product area: Intelligent system products
  2. Number of layers: 8L3 order HDI plate thickness 0.50mm;
  3. Process structure: FR-4+TG150, minimum hole 0.35mm, copper thickness 1OZ, line width line spacing 3/3mil,Impedance Ω ± 10%
  4. Surface treatment: Gold Finger + Electric Thick Gold 30U "
  5. Quantities range from prototype to volume production.
  6. 100% E-Test
  7. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging
  8. Printed circuit board (pcb) and PCBA product areas
    Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
    Winding circuit board (fpc) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Your single point of contact for all of your raw materials, parts, and pcb assembly, also offers

  1. - Contract Manufacturing
  2. - Engineering Services
  3. - PCB Design & Assembly
  4. - Product Design
  5. - Prototyping
  6. - Cable and Wire Assemblies
  7. - Plastics and Molds
  8. Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

     

    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

     

    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q:

    Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    PCB, FPC process production capability

    Technical ltem MassProduct Advanced Technology
    2016 2017 2018
    Max.Layer Count 26L 36L 80L
    Through-hole plate 2~45L 2~60L 2~80L
    Max.PCBSize(in) 24*52" 25*62" 25*78.75"
    The layer number of FPC 1~36L 1~50L 1~60L
    Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
    Layeredplatelayer 2~12L 2~18L 2~26L
    Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
    Combination of hard and soft layers 3~26L 3~30L 3~50L
    Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
    HDI PCB 4~45L 4~60L 4~80L
    Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
    Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
    Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
    Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
    Build-up Material FR-4 FR-4 FR-4
    BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
    Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
    Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
    Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
    MAX(mm) 3.5 10.0mm 10.0mm
    Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
    Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
    BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
    Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
    Gold thick 1~40u" 1~60u" 1~120u"
    Nithick 76~127u" 76~200u" 1~250u"
    Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
    Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    DieletricThickness 38(1.5) 32(1.3) 32(1.3)
    125(5) 125(5) 125(5)
    SKipvia Yes Yes Yes
    viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
    Laser Hole Filling Yes Yes Yes
    Technicalltem Mass Product Advanced Technolgy
    2017year 2018year 2019year
    Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
    Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
    Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
    Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    BGAPitch mm(Mil) 0.3 0.3 0.3
    Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
    Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
    2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
    ≦3mil ±0.60 ±0.60 ±0.60
    Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
    Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
    Multi-layer overlay N+N N+N N+N
    N+X+N N+X+N N+X+N
    sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    PTH filling process PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

     

    PCB, FPC main material supplier

    NO supplier Supply material name Material origin
    1 Japan High frequency materials, PI, covering membrane,Copper berth Mitsubishi Japan
    2 dupont High frequency materials, PI, covering film, dry film,Copper berth Japan
    3 panasonic High frequency materials, PI, covering membrane,Copper berth Japan
    4 SanTie PI, covering membrane Japan
    5 Born good FR-4,PI,PP,Copper berth shenzhen, China
    6 A rainbow PI, covering membrane,Copper berth Taiwan
    7 teflon High frequency materials The United States
    8 Rogers High frequency materials The United States
    9 Nippon Steel PI, covering membrane,Copper berth Taiwan
    10 sanyo PI, covering membrane,Copper berth Japan
    11 South Asia FR-4,PI,PP,Copper berth Taiwan
    12 doosan FR-4,PP South Korea
    13 Tai Yao plate FR-4,PP,Copper berth Taiwan
    14 Alight FR-4,PP,Copper berth Taiwan
    15 Yaoguang FR-4,PP,Copper berth Taiwan
    16 Yalong FR-4,PP The United States
    17 ISOAL FR-4,PP Japan
    18 OAK Buried, buried resistance, PP Japan
    19 United States 3M FR-4,PP The United States
    20 Bergs Copper and aluminum matrix Japan
    21 The sun ink Taiwan
    22 Murata ink Japan
    23 generous andbenevolent PI, covering membrane,Copper berth China's jiangxi
    24 Yasen PPI, covering membrane China jiangsu
    25 Yong Sheng Tai ink China guangdong panyu
    26 mita ink Japan
    27 Transcript ceramic material Taiwan
    28 HOME ceramic material Japan
    29 Fe-Ni-Mn Alloy Invar, Section Steel Taiwan

    Tag:

    order custom printed circuit board,

    hdi pcb design

     

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

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