Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Zhejiang Kunyu Electronic Technology Co., Ltd.
Shenzhen Mingze Electronic Technology Co., Ltd.

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Minimum Hole 0.10mm PCB Prototype Service 12 Layer Anylayer Structure Halogen Free

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PCB Prototype Service

PCB Prototype Service Sample Introduction

Minimum Hole 0.10mm PCB Prototype Service 12 Layer Anylayer Structure Halogen Free

China Minimum Hole 0.10mm PCB Prototype Service 12 Layer Anylayer Structure Halogen Free Supplier
Minimum Hole 0.10mm PCB Prototype Service 12 Layer Anylayer Structure Halogen Free Supplier Minimum Hole 0.10mm PCB Prototype Service 12 Layer Anylayer Structure Halogen Free Supplier

Large Image :  Minimum Hole 0.10mm PCB Prototype Service 12 Layer Anylayer Structure Halogen Free

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: cspcb1293

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: usd3.96/pcs
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 18-20day
Payment Terms: T/T, Western Union
Supply Ability: 200K/pcs per month
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Detailed Product Description
Product Areas: Communication Module Products Product Structure: 12-layer Anylayer
Material: FR-4, TG170, Halogen-free Board Thickness: 1.60
Impedance Value: ± 10% Minimum Hole: 0.15mm
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
PCBA Information: BOM Report, X, Y Left Plot
High Light:

circuit board printing service

,

custom pcb service

12-layer Anylayer structure, minimum hole 0.10mm, plate thickness 1.20mm, nickel palladium gold, green oil, metal edging + half hole + resin plug hole + plating filling

  1. Product area: Automotive system products
  2. Number of layers: 12 layers of order two HDI, FR-4, TG150, plate thickness 1.60mm, laser hole 0.1mm, hole in the plate, resin hole filling + copper filling copper,
  3. Impedance tolerance: ±10%
  4. Surface treatment: OSP + gold finger,
  5. Test method: computer 100% E-Test
  6. Packing: vacuum packaging + desiccant + humidity card + carton
  7. Mode of transport: air, sea, motor, logistics, express
  8. Product Type: Bluetooth Control Board

    Size: 78*52mm/1PCS

    12-layer Anylayer structure, minimum hole 0.10mm, plate thickness 1.60mm, nickel palladium gold, green oil, metal edging + half hole + resin plug hole + plating filling

  9. Printed circuit board (pcb) and PCBA product areas
    Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
    Winding circuit board (fpc) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Our service

  1. Surface Mount PCB assembly (Both rigid PCB, flexible PCB)
  2. PCBA contract manufacturing
  3. Electronic contract manufacturing service
  4. Through hole assembly/DIP assembly
  5. Bonding assembly
  6. Final assembly
  7. Full Turnkey Box Build
  8. Mechanical / electrical assembly
  9. Supply Chain Management/Components procurement
  10. PCB fabrication
  11. Technical support
  12. PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products:

     

    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

    Tag:

    pcb prototype assembly service,

    circuit board printing service

    PCB, FPC process production capability

    Technical ltem MassProduct Advanced Technology
    2016 2017 2018
    Max.Layer Count 26L 36L 80L
    Through-hole plate 2~45L 2~60L 2~80L
    Max.PCBSize(in) 24*52" 25*62" 25*78.75"
    The layer number of FPC 1~36L 1~50L 1~60L
    Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
    Layeredplatelayer 2~12L 2~18L 2~26L
    Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
    Combination of hard and soft layers 3~26L 3~30L 3~50L
    Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
    HDI PCB 4~45L 4~60L 4~80L
    Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
    Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
    Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
    Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
    Build-up Material FR-4 FR-4 FR-4
    BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
    Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
    Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
    Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
    MAX(mm) 3.5 10.0mm 10.0mm
    Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
    Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
    BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
    Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
    Gold thick 1~40u" 1~60u" 1~120u"
    Nithick 76~127u" 76~200u" 1~250u"
    Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
    Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    DieletricThickness 38(1.5) 32(1.3) 32(1.3)
    125(5) 125(5) 125(5)
    SKipvia Yes Yes Yes
    viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
    Laser Hole Filling Yes Yes Yes
    Technicalltem Mass Product Advanced Technolgy
    2017year 2018year 2019year
    Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
    Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
    Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
    Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    BGAPitch mm(Mil) 0.3 0.3 0.3
    Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
    Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
    2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
    ≦3mil ±0.60 ±0.60 ±0.60
    Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
    Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
    Multi-layer overlay N+N N+N N+N
    N+X+N N+X+N N+X+N
    sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    PTH filling process PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    Surface treatment:
    full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

Send your inquiry directly to us (0 / 3000)

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