Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Zhejiang Kunyu Electronic Technology Co., Ltd.
Shenzhen Mingze Electronic Technology Co., Ltd.

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FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics

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HDI Printed Circuit Boards

HDI Printed Circuit Boards Sample Introduction

FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics

China FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics Supplier
FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics Supplier FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics Supplier FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics Supplier FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics Supplier

Large Image :  FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: CSPCB1518

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: usd2.18/pcs
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 25-30day
Payment Terms: T/T, Western Union
Supply Ability: 200K/pcs per month
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Detailed Product Description
Product Areas: Medical Bluetooth Module Motherboard Material: FR-4 TG180
Line Width And Space: 3/3mil Aspect Ratio: 0.10mm
㎡/Number Of Holes: 201Million / Hole Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Provide PCB Information: Gberber, Production Requirements, MOQ Quantity PCBA Information: BOM Report, X, Y Left Plot
Impedance Value: ± 10% E-Test:: 100% Electrical Test Prior Shipment

FR4 TG180 High Speed HDI Printed Circuit Boards 16L Third Order For Consumer Electronics circuit board pcb PCB laminate

 

We are reliable and competitive manufacturer of PCBs with advanced technology,experienced workers,professional salesteam and competitive prices and high quality,we mainly specialize in 1 layer,2 layers,4 layers to 10 layers,12 layers,we offer HAL,OSP,immersion gold,etc,no MOQ , rosh compliant, all we need is your gerber file and quantity,then we will quote best price and do best for you,it is very easy,welcome to inquire anytime, tks for your interest.

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.


Process parameters:

Content Capability
Material FR4, TG130, TG140, TG160, TG170
Surface treatment HASL,Chemical Tin,ENIG(Immersion GOLD),OSP,IMT,Plating silver,GOLD Finger
Layers Single-sided,double-sided,4 layers, 6,8,10,12 Layers
Maxi. board size 800mmX508mm
Line width/space 0.1mm/ 0.1mm
Board thickness 0.2mm-4mm
Min.tolerance of Board thickness +/-8% - 10%
Copper foil thickness

Out Layer:17.5um/35um/70um/105um/140um/175um

Inner Layer:17.5um/35um/70um/105um/140um

Outline Tolerance CNC routing:+/-0.1mm , Punching: +/-0.1mm
V-CUT registration +/-0.15mm
PTH hole copper thickness 15um-50um
Warp and twist <=1%
Min registration of hole position +/-3mil(+/-0.76mm)
Min punching hole 0.8mm(Board thickness below 1.0mm .)
Min Punching Square slot (Board thickness below 1.0mm, 1.0mmX1.0mm)
Registration of printed circuit +/-0.076mm
Min drill hole diameter 0.2mm
Min tolerance of hole diameter +/-0.05mm
Thickness of surface treatment

Plating Gold:(Ni4um-6um ,Au 0.1um-0.5um)

Immersion GOLD: (Ni 5um-6um,Au:0.0254um-0.127um)

Plating Silver:(Ag 5um-8um)

V-CUT degree tolerance +/-5(degree)
V-CUT Board thickness 0.6mm-3.2mm
Min Legend width 0.1mm
Min Solder mask width 0.1mm
Min Solder mask ring 0.05mm

Our Quality processes include

  1. IQC: Incoming Quality Control (Incoming Materials Inspection)
  2. First Article Inspection for every process
  3. IPQC: In Process Quality Control
  4. QC: 100% Test & Inspection
  5. QA: Quality Assurance based on QC inspection again
  6. Workmanship: IPC-A-610, ESD
  7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
  8. Quality Assurance:
    Our Quality processes include:
    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

     

    Certificates:
    ISO9001-2008
    ISO/TS16949
    UL
    IPC-A-600G and IPC-A-610E Class II compliance
    Customer's requirements

     

    Quick Detail:

    1. PCB Assembly on SMT and DIP

    2. PCB schematic drawing/ layout /producing

    3. PCBA clone/change board

    4. Components sourcing and purchasing for PCBA

    5. Enclosure design and plastic injection molding

    6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

    7. IC programming

    Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

    PCB, FPC product application field

    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

    FAQ:

    Q: What files do you use in PCB fabrication?

    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

    Q: Is it possible you could offer sample?

    A: Yes, we can custom you sample to test before mass production

    Q: When will I get the quotation after sent Gerber, BOM and test procedure?

    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

    Q: How can I make sure the quality of my PCB?

    PCB, FPC process production capability

    Technical ltem MassProduct Advanced Technology
    2016 2017 2018
    Max.Layer Count 26L 36L 80L
    Through-hole plate 2~45L 2~60L 2~80L
    Max.PCBSize(in) 24*52" 25*62" 25*78.75"
    The layer number of FPC 1~36L 1~50L 1~60L
    Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
    Layeredplatelayer 2~12L 2~18L 2~26L
    Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
    Combination of hard and soft layers 3~26L 3~30L 3~50L
    Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
    HDI PCB 4~45L 4~60L 4~80L
    Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
    Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
    Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
    Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
    Build-up Material FR-4 FR-4 FR-4
    BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
    Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
    Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
    Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
    MAX(mm) 3.5 10.0mm 10.0mm
    Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
    Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
    BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
    Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
    Gold thick 1~40u" 1~60u" 1~120u"
    Nithick 76~127u" 76~200u" 1~250u"
    Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
    Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    DieletricThickness 38(1.5) 32(1.3) 32(1.3)
    125(5) 125(5) 125(5)
    SKipvia Yes Yes Yes
    viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
    Laser Hole Filling Yes Yes Yes
    Technicalltem Mass Product Advanced Technolgy
    2017year 2018year 2019year
    Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
    Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
    Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
    Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    BGAPitch mm(Mil) 0.3 0.3 0.3
    Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
    Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
    2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
    ≦3mil ±0.60 ±0.60 ±0.60
    Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
    Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
    Multi-layer overlay N+N N+N N+N
    N+X+N N+X+N N+X+N
    sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    PTH filling process PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

     

    PCB, FPC main material supplier

    NO supplier Supply material name Material origin
    1 Japan High frequency materials, PI, covering membrane,Copper berth Mitsubishi Japan
    2 dupont High frequency materials, PI, covering film, dry film,Copper berth Japan
    3 panasonic High frequency materials, PI, covering membrane,Copper berth Japan
    4 SanTie PI, covering membrane Japan
    5 Born good FR-4,PI,PP,Copper berth shenzhen, China
    6 A rainbow PI, covering membrane,Copper berth Taiwan
    7 teflon High frequency materials The United States
    8 Rogers High frequency materials The United States
    9 Nippon Steel PI, covering membrane,Copper berth Taiwan
    10 sanyo PI, covering membrane,Copper berth Japan
    11 South Asia FR-4,PI,PP,Copper berth Taiwan
    12 doosan FR-4,PP South Korea
    13 Tai Yao plate FR-4,PP,Copper berth Taiwan
    14 Alight FR-4,PP,Copper berth Taiwan
    15 Yaoguang FR-4,PP,Copper berth Taiwan
    16 Yalong FR-4,PP The United States
    17 ISOAL FR-4,PP Japan
    18 OAK Buried, buried resistance, PP Japan
    19 United States 3M FR-4,PP The United States
    20 Bergs Copper and aluminum matrix Japan
    21 The sun ink Taiwan
    22 Murata ink Japan
    23 generous andbenevolent PI, covering membrane,Copper berth China's jiangxi
    24 Yasen PPI, covering membrane China jiangsu
    25 Yong Sheng Tai ink China guangdong panyu
    26 mita ink Japan
    27 Transcript ceramic material Taiwan
    28 HOME ceramic material Japan
    29 Fe-Ni-Mn Alloy Invar, Section Steel Taiwan
  9. FR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For ElectronicsFR4 TG180 Material HDI Printed Circuit Boards 16L High Speed For Electronics

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

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