Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Zhejiang Kunyu Electronic Technology Co., Ltd.
Shenzhen Mingze Electronic Technology Co., Ltd.

Home
About Us
PCB Services
Equipment
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesMetal Substrate PCB

Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz

PCB Certifications
Good quality PCB Board Service
Good quality PCB Board Service
Customer Reviews
Very nice service, price is competitive and reasonable, process capability is very strong, quality is relatively stable! Delivery is fast and on time, I like working with your company.

—— Jocelyn

very nice service,you guys offer very good quality product and quick response on quotes, I am very happy and satisfied. thanks for all your support.

—— Chelsea

you guys offer very good quality product and quick response on quotes, I am very happy and satisfied. thanks for all your support.

—— Carina

very nice service,price is competitive and reasonable,you guys offer very good quality product and quick response on quotes, I am very happy and satisfied. thanks for all your support.

—— Daphne

Very nice service, price is competitive and reasonable, you guys offer very good quality product and quick response on quotes, I am very happy and satisfied. thanks for all your support.

—— Ishara

Very nice service, price is competitive and reasonable, process capability is very strong, equipment is more advanced! The quality is relatively stable! Delivery is fast and on time, I like working with your company.

—— Ailsa

very nice service,price is competitive and reasonable,you guys offer very good quality product and quick response on quotes, I am very happy and satisfied. thanks for all your support.

—— Kelly

Very nice service, price is competitive and reasonable, delivery is fast and on time, I like working with your company.

—— Abbott

Your service is very good, the price competition is reasonable, and the craft ability is good! stable quality! Delivery is fast and on time, I like to work with your company for a long time.

—— Chapman

Very good service, competitive price, reasonable price, advanced PCB, FPC and PCBA process capabilities, and equipment is great! The quality is relatively stable! I like to cooperate with your company for fast and punctual delivery.

—— Cyril Demaria

I'm Online Chat Now

Metal Substrate PCB

Metal Substrate PCB Sample Introduction

Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz

China Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz Supplier
Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz Supplier Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz Supplier Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz Supplier Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz Supplier

Large Image :  Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: 4-layer copper base + FR-4 + PPTG170 copper substrate, automotive new energy high-voltage charging pile,

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: Negotiation
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 18-20day
Payment Terms: L/C, T/T, Western Union
Supply Ability: 5-200K/pcs per month
Contact Now
Detailed Product Description
Base Material: TACONIC Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Copper Thickness: 1oz - 4oz Product Name: Watch Pcb
Pcb Assembly Method: Through-hole Pcb Test: Flying Probe And AOI (Default)/Fixture Test
Pcb Assembly Test: AOI,X-RAY Solder Mask Color: Green/Yellow/Black/White/Red/Blue
High Light:

metal core printed circuit board

,

metal clad pcb

4-layer copper base + FR-4 + PPTG170 copper substrate, Copper base high-voltage charging pile, charging pile

 

Product Description

  1. Number of layers: 4 layers of copper base + FR-4 + PPTG170
  2. Plate thickness: 6.5mm
  3. Product structure: 4 layers of copper base + FR-4 + PPTG170, deep trench, white oil
  4. Copper thickness 20OZ, electric nickel gold 30U"
  5. Packing: vacuum packaging + moisture-proof beads + humidity card + carton
  6. Printed circuit board meets 94V0 standard and complies with IPC610 Class 2 international PCB
  7. standard.
  8. The range ranges from prototype to mass production.
  9. 100% electronic test
  10. packaging method: vacuum packaging + desiccant + humidity card + high quality carton packaging or tin foil paper plus layer
  11. Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Complete box build

  1. Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
  2. plastics, casings and print & packaging material

Testing Methods

  1. AOI Testing
  2. Checks for solder paste
  3. Checks for components down to 0201"
  4. Checks for missing components, offset, incorrect parts, polarity
  5. X-Ray Inspection
  6. X-Ray provides high-resolution inspection of:
  7. BGAs
  8. Bare boards

In-Circuit Testing

  1. In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
  2. component problems.
  3. Power-up Test
  4. Advanced Function Test
  5. Flash Device Programming
  6. Functional testing

Quality Processes:

1. IQC: Incoming Quality Control (Incoming Materials Inspection)

2. First Article Inspection (FAI) for every process

3. IPQC: In Process Quality Control

4. QC: 100% Test & Inspection

5. QA: Quality Assurance based on QC inspection again

6. Workmanship: IPC-A-610, ESD

7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

 

Design file format:

 

1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG

2. BOM (bill of materials)

3. Pick and place file (XYRS)

 

Advantages:

1. Turnkey manufacturing or quick-turn prototypes

2. Board-level assembly or complete system integration

3. Low-volume or mixed-technology assembly for PCBA

4. Even consignment production

5. Supoorted capabilities

 

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2~45L 2~60L 2~80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1~36L 1~50L 1~60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2~12L 2~18L 2~26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3~26L 3~30L 3~50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4~45L 4~60L 4~80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1~40u" 1~60u" 1~120u"
Nithick 76~127u" 76~200u" 1~250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

 

PCB, FPC main material supplier

NO supplier Supply material name Material origin
1 Japan High frequency materials, PI, covering membrane,Copper berth Mitsubishi Japan
2 dupont High frequency materials, PI, covering film, dry film,Copper berth Japan
3 panasonic High frequency materials, PI, covering membrane,Copper berth Japan
4 SanTie PI, covering membrane Japan
5 Born good FR-4,PI,PP,Copper berth shenzhen, China
6 A rainbow PI, covering membrane,Copper berth Taiwan
7 teflon High frequency materials The United States
8 Rogers High frequency materials The United States
9 Nippon Steel PI, covering membrane,Copper berth Taiwan
10 sanyo PI, covering membrane,Copper berth Japan
11 South Asia FR-4,PI,PP,Copper berth Taiwan
12 doosan FR-4,PP South Korea
13 Tai Yao plate FR-4,PP,Copper berth Taiwan
14 Alight FR-4,PP,Copper berth Taiwan
15 Yaoguang FR-4,PP,Copper berth Taiwan
16 Yalong FR-4,PP The United States
17 ISOAL FR-4,PP Japan
18 OAK Buried, buried resistance, PP Japan
19 United States 3M FR-4,PP The United States
20 Bergs Copper and aluminum matrix Japan
21 The sun ink Taiwan
22 Murata ink Japan
23 generous andbenevolent PI, covering membrane,Copper berth China's jiangxi
24 Yasen PPI, covering membrane China jiangsu
25 Yong Sheng Tai ink China guangdong panyu
26 mita ink Japan
27 Transcript ceramic material Taiwan
28 HOME ceramic material Japan
29 Fe-Ni-Mn Alloy Invar, Section Steel Taiwan
30 Yingtan Copper and aluminum matrix China's jiangxi

 

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

 

Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

 

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PC

Fast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4ozFast Prototyping Metal Core Printed Circuit Board Copper Thickness 1oz - 4oz

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

Send your inquiry directly to us (0 / 3000)

PCB Sample

We are good quality supplier of PCB Board Service, PCB Assembly Services, PCB Prototype Service from China.