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Shenzhen Chaosheng Electronic Technology Co.,Ltd
Zhejiang Kunyu Electronic Technology Co., Ltd.
Shenzhen Mingze Electronic Technology Co., Ltd.

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Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level

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PCB Assembly Services

PCB Assembly Services Sample Introduction

Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level

China Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level Supplier
Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level Supplier Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level Supplier Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level Supplier

Large Image :  Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: CSPCB1530

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: usd2.28/pcs
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 15-20day
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: 2000K/pcs per month
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Detailed Product Description
Product Areas: High Power Power Optical Module PCB Product Structure: 8 Layers 3 Steps + Embedded Copper
Surface Finishing: Nickel Palladium + Gold Finger 20U " Communication Optical Module 5G: FR-4, TG170ISOLA370HR+M6
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
Impedance Value: ± 10% E-Test: 100%
High Light:

electronic assembly services

,

electronic pcb assembly

8 layers HD3 level, embedded copper PCB embedded embedded capacitance / buried resistance PCB Communication Network Optical Module PCB Power Optical Module PCB Wireless Optical Module PCB High Power Optical Module PCB

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

 

Product Description

  1. PCBA Technology Capability
  2. Smallest chip placement:0201
  3. Automated axial insertion and Automated radial insertion
  4. Computer controlled Pb free wave soldering system
  5. High speed Pb free surface mount production lines
  6. Providing electronic components purchase service for the customers
  7. ICT on line inspection, PCBA function test equipment, Visual inspection

Product Details

 

  1. Number of layers: 8L soft and hard combined HDI first-order layered board,
  2. Plate thickness: 1.60mm
  3. Process structure: 3m buried material + FR-4TG170, impedance Ω ± 10%,impedance Ω±10%, resin plug hole + copper fill hole
  4. Buried copper block + nose PAD + minimum hole 0.20mm
  5. Surface treatment: Shen Jin + electricity gold 3u"
  6. Minimum hole copper: 25um
  7. Quantities range from prototype to volume production.
  8. 100% E-Test
  9. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2~45L 2~60L 2~80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1~36L 1~50L 1~60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2~12L 2~18L 2~26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3~26L 3~30L 3~50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4~45L 4~60L 4~80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1~40u" 1~60u" 1~120u"
Nithick 76~127u" 76~200u" 1~250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

 

PCB, FPC main material supplier

NO supplier Supply material name Material origin
1 Japan High frequency materials, PI, covering membrane,Copper berth Mitsubishi Japan
2 dupont High frequency materials, PI, covering film, dry film,Copper berth Japan
3 panasonic High frequency materials, PI, covering membrane,Copper berth Japan
4 SanTie PI, covering membrane Japan
5 Born good FR-4,PI,PP,Copper berth shenzhen, China
6 A rainbow PI, covering membrane,Copper berth Taiwan
7 teflon High frequency materials The United States
8 Rogers High frequency materials The United States
9 Nippon Steel PI, covering membrane,Copper berth Taiwan
10 sanyo PI, covering membrane,Copper berth Japan
11 South Asia FR-4,PI,PP,Copper berth Taiwan
12 doosan FR-4,PP South Korea
13 Tai Yao plate FR-4,PP,Copper berth Taiwan
14 Alight FR-4,PP,Copper berth Taiwan
15 Yaoguang FR-4,PP,Copper berth Taiwan
16 Yalong FR-4,PP The United States
17 ISOAL FR-4,PP Japan
18 OAK Buried, buried resistance, PP Japan
19 United States 3M FR-4,PP The United States
20 Bergs Copper and aluminum matrix Japan
21 The sun ink Taiwan
22 Murata ink Japan
23 generous andbenevolent PI, covering membrane,Copper berth China's jiangxi
24 Yasen PPI, covering membrane China jiangsu
25 Yong Sheng Tai ink China guangdong panyu
26 mita ink Japan
27 Transcript ceramic material Taiwan
28 HOME ceramic material Japan
29 Fe-Ni-Mn Alloy Invar, Section Steel Taiwan
PCBs material: FR-4, 0.5oz - 6oz copper
0.45 to 3.2mm thickness
Minimum line width and line spacing: 4mil/4mil
Minimum hole diameter: 0.2mm
Maximum panel size: 680 x 1280mm
Surface finishing:
  • HAL, alpha level, gold plating, ENTech
  • HAL or tin and gold plating
Solder mask type: liquid photoimageable solder mark
Precision V-cut or routing for panel form design
OEM orders for SMT and A/I assembly projects accepted
Gerber file preferred
Please note the following information are for your reference on our manufacturing capability, not for inquiries on quotations
We will offer our best prices if you can send your own PCB design


Product Details:
Place of Origin:China
Brand Name:XCE
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Model Number:XCEH
Minimum Order Quantity:1pcs
Price:negotiation
Packaging Details:inner: vacuum-packed bubble bag outer: carton box
Delivery Time:5-10 days
Payment Terms:T/T,Western union
Supply Ability:1, 000, 000 PCS / week

Advantage Highlights

  • Specialized in 2- to 32-layer PCB
  • ISO 9001-, ISO 14001- and ISO/TS 16949-certified
  • Products are UL- and RoHS-certified
  • Partner for over 2000 small- and medium-scale customers
  • Two factory bases totaling 22,000 square meters
  • Less than 12-hours quick response to inquiries
  • Widely acclaimed and satisfying services
  • Over 66% of PCBs are exported to international markets

OEM Flexible Rigid PCB HDI 3m Buried Material FR4 TG170 For Optical Module ProductOEM Flexible Rigid PCB HDI 3m Buried Material FR4 TG170 For Optical Module Product

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

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