Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Zhejiang Kunyu Electronic Technology Co., Ltd.
Shenzhen Mingze Electronic Technology Co., Ltd.

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6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb

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Multilayer Printed Circuit Board

Multilayer Printed Circuit Board Sample Introduction

6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb

China 6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb Supplier
6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb Supplier 6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb Supplier 6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb Supplier

Large Image :  6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: CSPCB1335

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: USD0.86/PCS
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 25-28day
Payment Terms: T/T, Western Union
Supply Ability: 2000000pcs/per month
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Detailed Product Description
Base Material: FR-4 TG150 Board Thickness: 0.25mm
Application: Bonding The Electronic Components On A Substrate Minimum Line Width And Space: 3/3mil
Minimum Hole: 0.10mm Product Structure: 24-layer HDI
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
Surface Finishing: Shen Jin + Golden Finger Thick Gold 30U " TEST: 100% Electrical Test Prior Shipment

6layers, double-sided SD card ultra-thin PCB Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layerpcb,thin pcb Ultra Thin PCB rigid flex pcb manufacturers,thin pcb,four layer pcb Product Description prototype pcb service pcb service

Product area: memory card

Number of layers: 6layersThickness: 0.30mm

  1. Process structure: FR-4, line width line spacing 4/4mil,
  2. minimum hole 0.15mm, resin hole filling
  3. Surface treatment: immersion gold + gold finger
  4. Packing: vacuum packaging + humidity card + moisture-proof beads + carton
  5.  
  6. Printed circuit board (pcb) and PCBA product areas
    Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
    Winding circuit board (fpc) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Little knowledge - PCB Circuit Board

  1. A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.
  2. Components (e.g. capacitors, resistors or active devices) are generally soldered on the PCB. Advanced PCBs may contain components embedded in the substrate.
  3. There are three kinds of PCB, including single sided pcb (one copper layer), double sided pcb (two copper layers)and multi-layer pcb (outer and inner layers). Conductors on different layers are connected with vias. Multilayer PCBs allow for much higher component density
  4. PCB, FPC product application field
    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

     

    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: How can I know the process of my PCB production?
    A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

     

    PCB, FPC process production capability

    Technical ltem MassProduct Advanced Technology
    2016 2017 2018
    Max.Layer Count 26L 36L 80L
    Through-hole plate 2~45L 2~60L 2~80L
    Max.PCBSize(in) 24*52" 25*62" 25*78.75"
    The layer number of FPC 1~36L 1~50L 1~60L
    Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
    Layeredplatelayer 2~12L 2~18L 2~26L
    Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
    Combination of hard and soft layers 3~26L 3~30L 3~50L
    Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
    HDI PCB 4~45L 4~60L 4~80L
    Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
    Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
    Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
    Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
    Build-up Material FR-4 FR-4 FR-4
    BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
    Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
    Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
    Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
    MAX(mm) 3.5 10.0mm 10.0mm
    Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
    Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
    BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
    Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
    Gold thick 1~40u" 1~60u" 1~120u"
    Nithick 76~127u" 76~200u" 1~250u"
    Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
    Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    DieletricThickness 38(1.5) 32(1.3) 32(1.3)
    125(5) 125(5) 125(5)
    SKipvia Yes Yes Yes
    viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
    Laser Hole Filling Yes Yes Yes
    Technicalltem Mass Product Advanced Technolgy
    2017year 2018year 2019year
    Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
    Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
    Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
    Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    BGAPitch mm(Mil) 0.3 0.3 0.3
    Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
    Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
    2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
    ≦3mil ±0.60 ±0.60 ±0.60
    Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
    Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
    Multi-layer overlay N+N N+N N+N
    N+X+N N+X+N N+X+N
    sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    PTH filling process PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

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