Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Zhejiang Kunyu Electronic Technology Co., Ltd.
Shenzhen Mingze Electronic Technology Co., Ltd.

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6 Layers Flexible Rigid PCBFR4 / Polyimide Material ENIG Surface Finish Durable

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Flexible Rigid PCB

Flexible Rigid PCB Sample Introduction

6 Layers Flexible Rigid PCBFR4 / Polyimide Material ENIG Surface Finish Durable

China 6 Layers Flexible Rigid PCBFR4 / Polyimide Material ENIG Surface Finish Durable Supplier
6 Layers Flexible Rigid PCBFR4 / Polyimide Material ENIG Surface Finish Durable Supplier 6 Layers Flexible Rigid PCBFR4 / Polyimide Material ENIG Surface Finish Durable Supplier 6 Layers Flexible Rigid PCBFR4 / Polyimide Material ENIG Surface Finish Durable Supplier

Large Image :  6 Layers Flexible Rigid PCBFR4 / Polyimide Material ENIG Surface Finish Durable

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: CSPCB1344

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: 2.96usd/pcs
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 18-20day
Payment Terms: T/T, Western Union
Supply Ability: 50-200000K/pcs per month
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Detailed Product Description
Base Material:: Taihong PI+FR-4 ,TG170 Product Type: Industrial Bluetooth Headset
Board Thickness: Hard Board Thickness1.60mm,Soft Board Thickness0.15mm Product Structure: Provide PCB Information
Copper Thickness: 1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1OZ Minimum Line Width And Space: 3/3mil
Impedance Value: ± 10% Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin TEST: 100% Electrical Test Prior Shipment

6Layers Soft-hard 3rd Rigid Flex PCB FR4 / Polyimide Material ENIG Hasl OSP Surface Finish,rigid flex circuit boards,rig

Product Type: Industrial Bluetooth Headset

Size: 32.1*16mm/1PCS

Product structure: 6Layers Soft-hard 3rdof third-order soft and hard combination, minimum hole 0.10mm, plate thickness 0.60mm, nickel palladium gold, green oil,

Our Services

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

We are a Manufacturer & Supplier Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Ceramic PCB, Rogers PCB, Aluminum PCB. Meanwhile, we provide PCBA ( Assembly) and ODM, OEM service. We are specializes in a full SMT and through hole PCBA assembly, obtaining components, building prototype quantities, and testing. High quality,good price and service.

  1. Delivery time:4-60days.
  2. Certificates:UL,ISO9001,RoHS

Our capability

  1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products
  2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.
  3. We have advanced equipment for through-hole and SMT DIP COB cable assembly.
  4. ROHS compliant and lead-free process.
  5. In-circuit, functional tests& burn-in tests, full system test
  6. High output to guarantee prompt delivery.

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

Detailed Specification of Flexible PCB Manufacturing

Technical Specification
Layers: 4~60 Layers(flex Pcb) and 4~80 (rigid flex)  
Min Panel Size: 5mm x 8mm  
Max Panel Size: 250 x 520mm  
Min Finished board thickness: 0.05mm (1 sided inclusive copper)  
Max Finished board thickness: 0.3mm (2 sided inclusive copper)  
Finished board thickness tolerance: ±0.02~0.03mm  
Material: Kapton, Polyimide, PET  
Base copper thickness (RA or ED): 1/3 oz, 1/2 oz, 1oz, 2oz  
Base PI thickness: 0.5mil, 0.7mil, 0.8mil, 1mil, 2mil  
Stiffner: Polyimide, PET, FR4, SUS  
Min Finished hole diameter: Φ 0.15mm  
Max Finished hole diameter: Φ 6.30mm  
Finished hole diameter tolerance (PTH): ±2 mil ( ±0.050mm)  
Finished hole diameter tolerance (NPTH): ±1 mil ( ±0.025mm)  
Min width/spacing (1/3oz): 0.05mm/0.06mm  
Min width/spacing (1/2oz): 0.06mm/0.07mm  
Min width/spacing (1oz): Single layer: 0.07mm/0.08mm  
Double layer: 0.08mm/0.09mm  
Aspect Ratio 6:01 8:01
Base Copper 1/3Oz--2Oz 3 Oz for Prototype
Size Tolerance Conductor Width:±10% W ≤0.5mm
Hole Size: ±0.05mm H ≤1.5mm
Hole Registration: ±0.050mm  
Outline Tolerance:±0.075mm L ≤50mm
Surface Treatment ENIG: 0.025um - 3um  
OSP:  
Immersion Tin: 0.04-1.5um  
Dielectric Strength AC500V  
Solder Float 288℃/10s IPC Standard
Peeling Strength 1.0kgf/cm IPC-TM-650
Flammability 94V-O UL94


Quotation Requirement :
1) Following specifications are needed for quotation:
a) Base material
b) Board thickness:
c) Copper thickness
d) Surface treatment:
e) color of solder mask and silkscreen:
f) Quantity

Shiping method:
1) By DHL, Fedex, UPS, TNT etc.
2) By sea if it is possible
3) By air

Surface treatment:
full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

6Layers 2nd order HDI Rigid Flex PCB FR4 / Polyimide Material ENIG Hasl OSP Surface Finish,rigid flex circuit boards,rig6Layers 2nd order HDI Rigid Flex PCB FR4 / Polyimide Material ENIG Hasl OSP Surface Finish,rigid flex circuit boards,rig
Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2~45L 2~60L 2~80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1~36L 1~50L 1~60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2~12L 2~18L 2~26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3~26L 3~30L 3~50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4~45L 4~60L 4~80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1~40u" 1~60u" 1~120u"
Nithick 76~127u" 76~200u" 1~250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

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