Chaosheng Group (Hong Kong) Technology Development Co., Ltd.
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Zhejiang Kunyu Electronic Technology Co., Ltd.
Shenzhen Mingze Electronic Technology Co., Ltd.

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3HDI​ Large Motor Custom Printed Circuit Board PCB FR-4 TG150 Thick Copper 12 Layers

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HDI Printed Circuit Boards

HDI Printed Circuit Boards Sample Introduction

3HDI​ Large Motor Custom Printed Circuit Board PCB FR-4 TG150 Thick Copper 12 Layers

China 3HDI​ Large Motor Custom Printed Circuit Board PCB FR-4 TG150 Thick Copper 12 Layers Supplier
3HDI​ Large Motor Custom Printed Circuit Board PCB FR-4 TG150 Thick Copper 12 Layers Supplier 3HDI​ Large Motor Custom Printed Circuit Board PCB FR-4 TG150 Thick Copper 12 Layers Supplier 3HDI​ Large Motor Custom Printed Circuit Board PCB FR-4 TG150 Thick Copper 12 Layers Supplier 3HDI​ Large Motor Custom Printed Circuit Board PCB FR-4 TG150 Thick Copper 12 Layers Supplier

Large Image :  3HDI​ Large Motor Custom Printed Circuit Board PCB FR-4 TG150 Thick Copper 12 Layers

Product Details:

Place of Origin: Shenzhen, Guangdong, China
Brand Name: China chao sheng
Certification: ISO/UL/RoHS/TS
Model Number: CSPCB1488

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: usd6.98/PCS
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Delivery Time: 25-28day
Payment Terms: T/T, Western Union
Supply Ability: 2000000pcs/per month
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Detailed Product Description
Product Areas: Medical Bluetooth Module Motherboard Base Material: FR-4, TG150 Halogen-free
Copper Thickness: 1/1OZ 1OZ 1OZ 1OZ Impedance Value: ± 10%
Min. Line Spacing: 3/3mil Minimum Hole: 0.10mm
Layers: 16 Layers Level 4HDI​ Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Provide PCB Information: Gberber, Production Requirements, MOQ Quantity E-Test: 100% Electrical Test Prior Shipment

12 layers Level 3HDI​ Large motor motor PCB HDI FR-4, TG150 Thick copper + thick gold inner and outer copper ,HDI Printed Circuit Boards,prototype pcb fabrication

Product Description

1:12 layers Level 3HDI​, Bluetooth headset left and right board
2: FR-4, TG150, inner and outer copper thickness 35um, minimum line width line spacing 4/4mil, hole ratio 12:1, minimum hole 0.10mm, blind hole buried hole, sinking gold, green oil, white
3: The plate thickness is 1.70mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

Printed circuit board (pcb) and PCBA product areas
Communication terminals, communication stations, electronic communications, computers, household appliances, appliances, SD cards, SG cards, mobile phones, antennas, computers, automobiles, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, Aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other product applications;
Winding circuit board (fpc) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument , Medical equipment, banking equipment, industrial instruments, LED strips, military industry, aviation, aerospace, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

  1. Product area: Inductive drive products
  2. Number of layers: 8layers of second-order HDI,minimum hole 0.10mm, copper thickness 1OZ, line width line spacing 4/4mil, impedance Ω±10%, Resin plug hole + copper fill hole
  3. Plate thickness: 1.60mm
  4. Product structure: FR-4, TG150, inner and outer copper thickness 1OZ, impedance ±10%
  5. Solder mask green, immersion gold 15u"
  6. Quantities range from prototype to volume production.
  7. 100% E-Test
  8. Packaging: Vacuum Packaging + Moisture-proof Bead + Humidity Card + Carton
  9. LED: military, medical, laser, hole, optical and other LED small pitch PCB
    Product structure: 8ayers Level 2 HDI​
    Material: FR-4, TG170, halogen-free
    Board thickness: 1.60MM
    Size mm:
    Impedance value: ± 10%
    Minimum hole: 0.15mm
    Minimum line width and space:
    aspect ratio:
    Surface treatment: immersion gold, electro-nickel gold, immersion tin, OSP, lead-free spray tin
    Provide PCB information: Gberber, production requirements, MOQ quantity
    PCBA information: BOM report, X, Y left plot

Our Service

  1. PCB Production Service.
  2. PCB FPC design Service.
  3. PCB Assembly Service. (SMT, BGA, DIP)
  4. PCBA Housing assembly serivce.
  5. PCBA Final Functional Testing.
  6. PCB PCBA Copy Service.
  7. Electronic Components Purchasing & BOM List Purchasing Services.
  8. PCB SMT Stencil. (Laser cut & Etching)
  9. Quality Assurance:
    Our Quality processes include:
    1. IQC: Incoming Quality Control (Incoming Materials Inspection)
    2. First Article Inspection for every process
    3. IPQC: In Process Quality Control
    4. QC: 100% Test & Inspection
    5. QA: Quality Assurance based on QC inspection again
    6. Workmanship: IPC-A-610, ESD
    7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

     

    Certificates:
    ISO9001-2008
    ISO/TS16949
    UL
    IPC-A-600G and IPC-A-610E Class II compliance
    Customer's requirements

     

    Quick Detail:

    1. PCB Assembly on SMT and DIP

    2. PCB schematic drawing/ layout /producing

    3. PCBA clone/change board

    4. Components sourcing and purchasing for PCBA

    5. Enclosure design and plastic injection molding

    6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

    7. IC programming

     

     

    PCB, FPC product application field
    Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

     

    FAQ:
    Q: What files do you use in PCB fabrication?
    A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
    Q: Is it possible you could offer sample?
    A: Yes, we can custom you sample to test before mass production
    Q: When will I get the quotation after sent Gerber, BOM and test procedure?
    A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
    Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
    A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
    Q: How can I make sure the quality of my PCB?
    A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

  10. PCB, FPC process production capability

    Technical ltem MassProduct Advanced Technology
    2016 2017 2018
    Max.Layer Count 26L 36L 80L
    Through-hole plate 2~45L 2~60L 2~80L
    Max.PCBSize(in) 24*52" 25*62" 25*78.75"
    The layer number of FPC 1~36L 1~50L 1~60L
    Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
    Layeredplatelayer 2~12L 2~18L 2~26L
    Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
    Combination of hard and soft layers 3~26L 3~30L 3~50L
    Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
    HDI PCB 4~45L 4~60L 4~80L
    Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
    Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
    Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
    Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
    Build-up Material FR-4 FR-4 FR-4
    BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
    Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
    Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
    Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
    MAX(mm) 3.5 10.0mm 10.0mm
    Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
    Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
    BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
    Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
    Gold thick 1~40u" 1~60u" 1~120u"
    Nithick 76~127u" 76~200u" 1~250u"
    Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
    Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
    DieletricThickness 38(1.5) 32(1.3) 32(1.3)
    125(5) 125(5) 125(5)
    SKipvia Yes Yes Yes
    viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
    Laser Hole Filling Yes Yes Yes
    Technicalltem Mass Product Advanced Technolgy
    2017year 2018year 2019year
    Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
    Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
    Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
    Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
    BGAPitch mm(Mil) 0.3 0.3 0.3
    Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
    Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
    2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
    ≦3mil ±0.60 ±0.60 ±0.60
    Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
    Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
    Multi-layer overlay N+N N+N N+N
    N+X+N N+X+N N+X+N
    sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
    PTH filling process PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    PTH resin plug hole + plating fill
    Electroplated hole/copper plug hole
    18 layers of second-order HDI FR-4, TG170,+M6 inner and outer copper ,HDI Printed Circuit18 layers of second-order HDI FR-4, TG170,+M6 inner and outer copper ,HDI Printed Circuit

Contact Details
Shenzhen Chaosheng Electronic Technology Co.,Ltd

Contact Person: Mank.Li

Tel: 13528819118

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